Application of alpha alumina abrasive in PI material polishing
A technology of alpha alumina and abrasives, which is applied in the direction of polishing compositions containing abrasives, etc., and can solve the problems of limited application range and low polishing rate
Pending Publication Date: 2020-07-07
ANJI MICROELECTRONICS (SHANGHAI) CO LTD
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Problems solved by technology
However, the scope of use of this polishing liquid is not wide, especially the polishing rate of the aforementioned PI-2610 type dielectric material is low
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[0017] The advantages of the present invention are further described below through specific examples, but the protection scope of the present invention is not limited only to the following examples.
[0018] Table 1 shows Examples 1-5 and Comparative Example 1 of the chemical mechanical polishing fluid of the present invention. Wherein, the embodiment of the present invention adopts the alpha alumina abrasive as acidic alpha alumina.
[0019] Table 1 Comparative Example 1 and polishing fluid 1-5 of the present invention
[0020]
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Abstract
The invention provides application of an alpha alumina abrasive in PI material polishing. The alpha alumina abrasive material is mixed with a chemical mechanical polishing solution to form a composition for use, the content of the alpha alumina abrasive material is 0.1%-1.0%, and the chemical mechanical polishing solution has good colloid stability in a pH range of less than 7. According to the invention, the alpha alumina abrasive is used, and the polishing rate of the PI material is improved by controlling the content of alpha alumina and the pH value of the polishing solution.
Description
technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to the use of an alpha alumina abrasive in polishing PI materials. Background technique [0002] With the rapid development of science and technology, the trend of semiconductor production industry towards low-dimensional, large-scale (LSI) and even ultra-large-scale (ULSI) integration is becoming increasingly obvious. When the size of electronic components is reduced to a certain scale, the inductance-capacitance effect between wirings is gradually enhanced, and the mutual influence of wire currents makes signal hysteresis become very prominent, which seriously affects the development of the semiconductor industry. Reducing the dielectric constant of dielectric materials can reduce the electronic delay between interconnection layers, thus becoming an important means to reduce signal delay time. This depends on the development and application of new low dielec...
Claims
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Login to View More IPC IPC(8): C09G1/02
CPCC09G1/02
Inventor 李守田尹先升贾长征
Owner ANJI MICROELECTRONICS (SHANGHAI) CO LTD
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