Application of alpha alumina abrasive in PI material polishing

A technology of alpha alumina and abrasives, which is applied in the direction of polishing compositions containing abrasives, etc., and can solve the problems of limited application range and low polishing rate

Pending Publication Date: 2020-07-07
ANJI MICROELECTRONICS (SHANGHAI) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the scope of use of this polishing liquid is not wide, especially th

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  • Application of alpha alumina abrasive in PI material polishing
  • Application of alpha alumina abrasive in PI material polishing
  • Application of alpha alumina abrasive in PI material polishing

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Embodiment Construction

[0017] The advantages of the present invention are further described below through specific examples, but the protection scope of the present invention is not limited only to the following examples.

[0018] Table 1 shows Examples 1-5 and Comparative Example 1 of the chemical mechanical polishing fluid of the present invention. Wherein, the embodiment of the present invention adopts the alpha alumina abrasive as acidic alpha alumina.

[0019] Table 1 Comparative Example 1 and polishing fluid 1-5 of the present invention

[0020]

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Abstract

The invention provides application of an alpha alumina abrasive in PI material polishing. The alpha alumina abrasive material is mixed with a chemical mechanical polishing solution to form a composition for use, the content of the alpha alumina abrasive material is 0.1%-1.0%, and the chemical mechanical polishing solution has good colloid stability in a pH range of less than 7. According to the invention, the alpha alumina abrasive is used, and the polishing rate of the PI material is improved by controlling the content of alpha alumina and the pH value of the polishing solution.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to the use of an alpha alumina abrasive in polishing PI materials. Background technique [0002] With the rapid development of science and technology, the trend of semiconductor production industry towards low-dimensional, large-scale (LSI) and even ultra-large-scale (ULSI) integration is becoming increasingly obvious. When the size of electronic components is reduced to a certain scale, the inductance-capacitance effect between wirings is gradually enhanced, and the mutual influence of wire currents makes signal hysteresis become very prominent, which seriously affects the development of the semiconductor industry. Reducing the dielectric constant of dielectric materials can reduce the electronic delay between interconnection layers, thus becoming an important means to reduce signal delay time. This depends on the development and application of new low dielec...

Claims

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Application Information

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IPC IPC(8): C09G1/02
CPCC09G1/02
Inventor 李守田尹先升贾长征
Owner ANJI MICROELECTRONICS (SHANGHAI) CO LTD
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