Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A heat-dissipating conductive double-sided adhesive and its production process

A conductive double-sided adhesive, heat-dissipating technology, used in conductive adhesives, adhesives, film/sheet adhesives, etc. Thermal conductivity and heat dissipation efficiency, good heat dissipation effect, and the effect of increasing temperature difference

Active Publication Date: 2021-10-08
东莞市星勤胶粘制品有限公司
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The heat-dissipating conductive double-sided adhesive in the prior art is usually simply placed together with the conductive double-sided adhesive and the heat-dissipating double-sided adhesive. In actual use, due to the excellent thermal conductivity of the graphite sheet, the flexible circuit board and electronic products pass through the heat-dissipating adhesive. The heat at the joints of the layers can be dissipated better, but the heat dissipation efficiency is still low at the joints of the conductive double-sided adhesive

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A heat-dissipating conductive double-sided adhesive and its production process
  • A heat-dissipating conductive double-sided adhesive and its production process
  • A heat-dissipating conductive double-sided adhesive and its production process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0044] refer to figure 1 , is a kind of heat-dissipating conductive double-sided adhesive disclosed by the present invention, comprising a carrier layer 1, a colloid layer 2 and a release layer 22 arranged in sequence from bottom to top, wherein the carrier layer 1 is a transparent silicone protective film, and the colloid layer 2 is located above the bearing layer 1, and the colloidal layer 2 and the release layer 22 form a colloidal unit 21, the number of colloidal units 21 is multiple, and the plurality of colloidal units 21 are arranged at intervals along the length direction of the bearing layer 1 on the bearing layer 1 , and the bearing layer 1 can finally be rolled into a roll that occupies a small space and is easy to transport.

[0045] refer to figure 2 and image 3 , the colloid layer 2 includes a conductive adhesive layer and a heat dissipatio...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
widthaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention relates to the technical field of conductive double-sided adhesive, in particular to a heat-dissipating conductive double-sided adhesive and its production process. The heat-dissipating conductive double-sided adhesive includes a bearing layer, a colloid layer and a release layer arranged in sequence from bottom to top. The colloidal layer includes a conductive adhesive layer and a heat dissipation adhesive layer group. The heat dissipation adhesive layer group includes an upper adhesive layer, a graphite sheet and a lower adhesive layer bonded in sequence from top to bottom. The thickness of the conductive adhesive layer is the same as the total thickness of the heat dissipation adhesive layer group. , and the conductive adhesive layer is separated from the heat dissipation adhesive layer group to form a thermal gap, the width of the thermal gap is 0.5-0.8mm; the conductive adhesive layer is used to match the exposed copper area of ​​the flexible circuit board; the upper adhesive layer and the lower adhesive layer The shape of the graphite sheet is suitable, and the side edges of the upper glue layer and the lower glue layer protrude from the outer contour of the graphite sheet, and the upper glue layer and the lower glue layer are bonded to each other to form a coating glue that covers the graphite sheet . The heat dissipation type conductive double-sided adhesive has high overall heat dissipation efficiency.

Description

technical field [0001] The invention relates to the technical field of conductive double-sided adhesive tape, in particular to a heat-dissipating conductive double-sided adhesive tape and a production process thereof. Background technique [0002] The flexible circuit board is usually bonded to a predetermined position of the electronic product by using conductive double-sided adhesive, which is used to realize relative fixation and circuit conduction between the flexible circuit board and the electronic product at the same time. [0003] After the circuit conduction between the flexible circuit board and the electronic product is realized, heat will inevitably be generated due to the existence of resistance. It will cooperate with the heat-dissipating double-sided adhesive tape to improve the stability of the connection between the flexible circuit board and the electronic product, and at the same time improve the heat dissipation efficiency of the joint between the flexibl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/21C09J7/20C09J9/02
CPCC09J9/02C09J2400/10C09J2400/263C09J7/20C09J7/21
Inventor 陈康陈健万均成
Owner 东莞市星勤胶粘制品有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com