Epoxy resin composition for semiconductor molding, and molding film and semiconductor package using same
A technology for molding semiconductors and epoxy resins, applied in epoxy resin coatings, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as reduced visibility, improve visibility, improve durability, and improve performance Effect
Active Publication Date: 2020-07-10
LG CHEM LTD
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- Abstract
- Description
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Problems solved by technology
[0009]
However, since an excessive amount of inorganic filler is added in this way, there is a limitation of reduced visibility even without adding additional pigments or dyes in the final fabricated semiconductor package.
Method used
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preparation example and
[0160] [Preparation Example and Comparative Example] Preparation of Epoxy Resin
preparation example 1
[0162] A solid polymer (weight-average molecular weight: 1874 g / mol) represented by the following chemical formula A and a liquid compound [(3',4'-epoxycyclohexane)methyl 3,4-epoxycyclo Hexyl carboxylate (Daicel, Celloxide 2021P) was mixed in a weight ratio of 5:4 to prepare epoxy resin.
[0163] [chemical formula A]
[0164]
[0165] In Chemical Formula A, R is a butyl group, and n is an integer of 15.
[0166] [chemical formula B]
[0167]
preparation example 2
[0169] An epoxy resin was prepared in the same manner as in Preparation Example 1, except that the solid polymer represented by the chemical formula A was mixed with the liquid compound [(3′,4′-epoxycyclohexane)methyl represented by the chemical formula B 3,4-Epoxycyclohexylcarboxylate (Daicel, Celloxide 2021P)] was changed to 6:4 by weight ratio
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Abstract
The present invention relates to an epoxy resin composition for semiconductor molding, which has excellent heat resistance and mechanical properties and has a low thermal expansion coefficient and thus exhibits an improved bending property, and has an improved visibility, and a molding film and a semiconductor package using the epoxy resin composition for semiconductor molding.
Description
technical field [0001] Cross References to Related Applications [0002] This application claims Korean Patent Application No. 10-2018-0004041 filed with the Korean Intellectual Property Office on January 11, 2018 and Korean Patent Application No. 10-2019-0001976 filed with the Korean Intellectual Property Office on January 7, 2019 The entire contents of which are hereby incorporated by reference. [0003] The present invention relates to an epoxy resin composition for molding a semiconductor, a molding film using the same, and a semiconductor package. More specifically, the present invention relates to an epoxy resin for molding semiconductors having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics Compositions, and molded films and semiconductor packages using such epoxy resin compositions for molding semiconductors. Background ...
Claims
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IPC IPC(8): C08L63/00C08K3/013C08K3/36C08G59/14C08J5/18H01L23/29
CPCC08G59/14C08K3/36C08L63/00C09D163/00C08G59/38C08G59/3218C08G59/24H01L23/562H01L23/295C08K3/013C08G59/145C08J5/18C08L2203/162C08K2201/005C08L2205/025C08J2363/00C08K2201/003
Inventor 郑珉寿庆有真崔炳柱郑遇载李光珠赵安部
Owner LG CHEM LTD