Heating system of spray plate in pe-CVD reactor

Abstract

The invention discloses a heating system for a spray plate of a PE-CVD reactor, comprising: a spray plate module uniformly distributed along the circumference of the upper cover plate of the reactor, the spray plate module includes a spray plate body, a spray plate The upper insulating plate, the insulating cylinder on the side of the spraying plate, and the electric heating assembly of the spraying plate, the upper surface of the spraying plate substrate in the spraying plate body has a plurality of deep holes evenly distributed along its circumference, and the electric heating of the spraying plate The assembly includes an electric heating element, a grounding shielding cylinder and a first electrical insulation sleeve, wherein the electric heating elements are arranged in the deep holes one by one, the grounding shielding cylinder is arranged on the outer periphery of the electric heating element, and the first An electrical insulation sleeve is arranged between the outer wall of the ground shielding cylinder and the inner wall of the deep hole. The heating system of the spray plate of the PE-CVD reactor has a reasonable structure, which can avoid the interference of radio frequency on the electric heating components, can avoid the influence of electric heating on the radio frequency field, and can realize effective and nearly uniform heating of the spray plate body .

Description

technical field [0001] The invention relates to the field of semiconductor coating equipment, and particularly provides a heating system for a spray plate of a PE-CVD reactor. Background technique [0002] With the modern technological innovation, the demand for semiconductor chips is increasing day by day, and semiconductor thin film equipment has also ushered in new challenges. The spray plate system is a particularly important key part, which is used for uniform gas distribution, loading radio frequency, control of the temperature of the reaction gas and the temperature of the reaction chamber, etc. Among them, the temperature of the reaction gas and the temperature of the reaction chamber are controlled. especially important. [0003] In the existing semiconductor coating equipment, the heating system of the spray plate is usually oil heating or electric heating. However, the oil heating method has a relatively cumbersome oil temperature machine and a long conveying pip...

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Problems solved by technology

[0003] In the existing semiconductor coating equipment, the heating system of the spray plate is usually oil temperature heating or electric heating. However, the oil temperature heating method has a relatively cumbersome oil temperature machine and a long delivery pipeline. If the pipeline is too long, it will lose a lot At the same time, a large number of oil pipes will also affect the overall simplicity and maintainability of the equipment. The electric heating method will affect the radio frequency when the current is applied, and then affect the radio frequency field. Therefore, a very complicated structural design is required To shield the influence of radio frequency, a filtering system is also required, which is relatively complicated overall. In addition, these two methods also have the problem of difficulty in controlling the uniformity of spray plate heating

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