Radiator

Abstract

The invention provides a radiator. The radiator comprises a substrate (1) and fins, wherein the plurality of fins are arranged on the substrate (1) at intervals, an overflowing hole is formed in eachfin, a preset included angle is formed between each fin and the incoming direction of an air flow, the fins comprise a head-end fin (2) making contact with the air flow firstly and a tail-end fin (3)making contact with the air flow finally in the incoming direction of the airflow, the overflowing hole located at in the head-end fin (2) is a head-end overflowing hole (4), the overflowing hole located at in the tail-end fin (3) is a tail-end overflowing hole (5), the overflowing holes between the head-end overflowing hole (4) and the tail-end overflowing hole (5) are middle overflowing holes (6), and the middle overflowing holes (6) are all located in the center line of the head-end overflowing hole (4) and the tail-end overflowing hole (5). According to the radiator, the laminar flow stateof the surfaces of the fins of the radiator can be broken, air flow fields between the fins and around the fins are improved, and the radiating efficiency of a heat component is enhanced.

Description

technical field [0001] The present application relates to the technical field of heat dissipation, in particular to a heat sink. Background technique [0002] At present, due to the popularization of intelligence and integration, many electronic components generate a lot of heat, but they are concentrated and compactly placed on the same circuit board. In order to ensure the long-term reliability of components and ensure the normal operation of equipment, heat dissipation devices are added. is an effective method. [0003] The current heat dissipation methods include: using cooling fins to dissipate heat from heating components, or using a combination of fans and fins to dissipate heat, but due to the placement of fins and heating components and the wind field between the fins Influence, resulting in low heat dissipation efficiency of the radiator, laminar flow on the surface of the fins, low air velocity, insufficient heat transfer, and continuous high-temperature operatio...

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Problems solved by technology

[0003] The current heat dissipation methods include: using cooling fins to dissipate heat from heating components, or using a combination of fans and fins to dissipate heat, but due to the placement of fins and heating components and the wind field between the fins Influence, resulting in low heat dissipation efficiency of the radiator, laminar flow on the surface of the fins, low air flow rate, insufficient heat transfer, and continuous high-temperature operation of the heating module, which has a great impact on the use of equipment and has a greater impact on the reliability of components. big impact

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