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A kind of Al-based oriented carbon nanotube copper-plated composite heat dissipation material and preparation method thereof

A technology of composite heat dissipation materials and carbon nanotubes, which is applied in the direction of metal material coating process, superimposed layer plating, gaseous chemical plating, etc., can solve the problems of difficult heat dissipation materials and low thermal conductivity, and solve the problems of heavy weight Effect

Active Publication Date: 2022-02-08
郑州中科新兴产业技术研究院 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the anisotropic structural properties of carbon nanotubes lead to low thermal conductivity in the non-axial direction, making it difficult to be used alone as a heat dissipation material.

Method used

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  • A kind of Al-based oriented carbon nanotube copper-plated composite heat dissipation material and preparation method thereof
  • A kind of Al-based oriented carbon nanotube copper-plated composite heat dissipation material and preparation method thereof
  • A kind of Al-based oriented carbon nanotube copper-plated composite heat dissipation material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A method for preparing aluminum-based oriented carbon nanotube copper-plated composite heat dissipation material, the steps are as follows:

[0031] Use chemical vapor deposition to grow aligned carbon nanotube arrays on an aluminum sheet. Soak the aluminum sheet in ethanol for 5 minutes, put it into a tube furnace after drying, and put 0.1 g of ferrocene solid in the tube furnace as a catalyst. Heating to 630° C. in an argon atmosphere for 60 minutes, feeding hydrogen to maintain a reducing atmosphere, and feeding ethylene as a carbon source to obtain an aluminum-based aligned carbon nanotube array. Such as figure 1 As shown, the carbon nanotubes in the composite material grow vertically on the aluminum substrate, and the carbon nanotubes are aligned in parallel. After testing, the thermal conductivity of the material is 372 W / mK, which is higher than the thermal conductivity of aluminum material of 237 W / mK.

[0032] The aluminum-based aligned carbon nanotube array ...

Embodiment 2

[0035] A method for preparing aluminum-based oriented carbon nanotube copper-plated composite heat dissipation material, the steps are as follows:

[0036] Use chemical vapor deposition to grow aligned carbon nanotube arrays on an aluminum sheet. Soak the aluminum sheet in ethanol for 5 minutes, put it into a tube furnace after drying, and put 0.1 g of ferrocene solid in the tube furnace as a catalyst. Heating to 640° C. in an argon atmosphere for 60 minutes, feeding hydrogen to maintain a reducing atmosphere, and feeding ethylene as a carbon source to obtain an aluminum-based aligned carbon nanotube array.

[0037] The aluminum-based aligned carbon nanotube array is used as the cathode, and the copper plate is used as the anode for copper electroplating. Plating solution composition: copper pyrophosphate 50 g / L, potassium pyrophosphate 200 g / L, ammonium citrate 20 g / L, PEG1500 0.4 g / L, 2-mercaptobenzimidazole 0.5%, 2-mercaptobenzothiazole 0.5% , selenium dioxide 0.2g / L. Cop...

Embodiment 3

[0040] A method for preparing aluminum-based oriented carbon nanotube copper-plated composite heat dissipation material, the steps are as follows:

[0041] Oriented carbon nanotube arrays were grown on an aluminum sheet by chemical vapor deposition. The aluminum sheet was soaked in ethanol and ultrasonicated for 5 minutes. After drying, it was placed in a tube furnace, and a ferrocene solid was placed in the tube furnace as a catalyst. Heating to 640° C. for 60 minutes in an air atmosphere, passing through hydrogen to maintain a reducing atmosphere, passing through acetylene as a carbon source, and obtaining an array of Al-based aligned carbon nanotubes.

[0042]The aluminum-based aligned carbon nanotube array is used as the cathode, and the copper plate is used as the anode for copper electroplating. Plating solution composition: copper pyrophosphate 60 g / L, potassium pyrophosphate 300 g / L, ammonium citrate 30 g / L, PEG2000 0.8 g / L, 2-mercaptobenzimidazole 1.2%, 2-mercaptobenz...

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Abstract

The invention provides an aluminum-based oriented carbon nanotube copper-plated composite heat dissipation material and a preparation method thereof. The composite material is composed of metal copper, aluminum and carbon nanotubes. The carbon nanotubes are grown on the aluminum to form an oriented array, and the copper The carbon nanotube / copper beaded structure is formed by growing on the carbon nanotube, and the aluminum-based oriented carbon nanotube copper-plated composite heat dissipation material is prepared. The invention constructs the aluminum / carbon nanotube / copper three-dimensional heat transport path, compensates for the heat dissipation defects of copper, aluminum, and carbon nanotubes, and synergistically exerts their advantages to obtain a composite heat dissipation material with high thermal conductivity.

Description

technical field [0001] The invention relates to the field of heat dissipation materials, in particular to an aluminum-based oriented carbon nanotube copper-plated composite heat dissipation material and a preparation method thereof. Background technique [0002] With the development of science and technology, electronic products such as smartphones, notebook computers, computers, digital cameras, and high-power products such as light-emitting diodes and LED lighting products have continuously improved performance and integration requirements, resulting in a rapid increase in the heat generated per unit area of ​​the device. The high-performance heat dissipation material quickly transfers the heat in the device, so that the device will not be damaged due to excessive temperature. Traditional heat dissipation materials have become more and more difficult to meet the growing demand for heat dissipation, and new heat dissipation materials are in urgent need of development. [0...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C28/00C23C16/26C25D3/38C25D7/00
CPCC23C28/322C23C28/343C23C16/26C25D3/38C25D7/006
Inventor 李会林郭强李永利田登超付明波李申赵俊利朱顺伟
Owner 郑州中科新兴产业技术研究院