Electrostatic chuck and electrostatic chuck apparatus including same
An electrostatic chuck and electrostatic force technology, which is applied to the holding device, positioning device, circuit and other directions of applying electrostatic attraction, can solve the problems of surface damage of sapphire plate, difficulty in using electrostatic chuck, characteristic degradation, etc., so as to improve the plasma impedance. characteristics, the effect of suppressing the degradation of plasma impedance characteristics
Active Publication Date: 2020-07-24
SEMES CO LTD
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Problems solved by technology
However, it can be difficult to utilize electrostatic chucks during heat treatment processes because the adhesive that bonds the sapphire plate to the insulating plate can easily be exposed to the plasma to generate arcs or discharges
On the other hand, when no adhesive is used, a fusion process may be required to melt a portion of the sapphire plate at a relatively high temperature, which may result in damage to the surface of the sapphire plate or degradation of its characteristics
Also, it may be difficult to embed conductive material into the sapphire plate, and thus may be difficult to act as an electrostatic chuck
Method used
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[0034] While various embodiments are susceptible to various modifications and alternative forms, specific details thereof have been shown by way of example in the drawings and will be described in more detail. It should be understood, however, that the intention is not to limit the invention as claimed to the particular embodiments described. On the contrary, the invention is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the subject matter defined by the claims.
[0035] Hereinafter, specific embodiments regarding a raceway unit and an OHT having the same will be described in more detail with reference to the accompanying drawings. However, this invention may be embodied in different forms and should not be construed as limited to only the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those...
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Abstract
The invention discloses an electrostatic chuck. The electrostatic chuck fixes a work substrate by an electrostatic force. The electrostatic chuck includes a dielectric plate being configured to support the work substrate, and a base plate is configured to support the dielectric plate and an adsorption electrode, is interposed between the dielectric plate and the base plate, and is configured to generate an electrostatic force for adsorbing the work substrate. The dielectric plate is a sapphire plate, the base plate consists of a alumina ceramic material, the adsorption electrode has a resistance change rate of 20% or less in a range of -200 DEG C to 400 DEG C, and the dielectric plate and the base plate are integrally bonded through the adsorption electrode.
Description
technical field [0001] The invention relates to an electrostatic chuck and an electrostatic chuck device comprising the same. Background technique [0002] The invention relates to an electrostatic chuck and an electrostatic chuck device comprising the same. [0003] Typically, electrostatic chucks are positioned in process chambers of semiconductor manufacturing equipment to support wafers using electrostatic forces. The electrostatic chuck can include a suction plate or a sapphire plate for holding the wafer (please refer to the related art below). [0004] Related techniques are disclosed in Japanese Patent Application Laid-Open Nos. 1994-291175 and 1997-82788. [0005] An adhesive such as an adhesive may be used to bond the sapphire plate to the insulating plate, and an adhesive may be used to bond the insulating plate to the support plate. However, it may be difficult to utilize the electrostatic chuck during the heat treatment process because the adhesive bonding th...
Claims
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IPC IPC(8): H01L21/683
CPCH01L21/6833H01J37/32715H01L21/68757H01L21/6831H01L21/67103H01L21/6875H01L21/6835H01L21/67248H01L21/6838H01L21/67109H02N13/00B23Q3/15
Inventor 李相起森谷义明
Owner SEMES CO LTD