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Air pressure regulated magnetic control film transfer printing stamp and transfer printing method

A technology of air pressure regulation and magnetic thin film, which is applied in the manufacture of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc. It can solve the problems of limited pick-up force and inability to pick up electronic devices, and achieve precise and selective transfer printing with low production costs. , to achieve the effect of selective transfer

Active Publication Date: 2020-07-24
ZHEJIANG UNIV
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the stamp has limited pick-up force and cannot pick up electronic devices from strongly adhered donor substrates.

Method used

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  • Air pressure regulated magnetic control film transfer printing stamp and transfer printing method
  • Air pressure regulated magnetic control film transfer printing stamp and transfer printing method
  • Air pressure regulated magnetic control film transfer printing stamp and transfer printing method

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Embodiment Construction

[0031] The content of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0032] As an example, but not to limit the scope of the invention, figure 1 It is a structural schematic diagram of the smallest unit of the magnetic control thin film transfer stamp of the air pressure regulation of the present invention. The material of the stamp body 1 is PDMS prepared with a cavity array (the ratio of the curing agent to the body is 1:10), and the top of the stamp body 1 is also provided with a vent hole 4 communicating with the cavity, and the magnetic film 2 divides the cavity into There are two upper and lower layers, of which the upper layer is the upper cavity 1-1 with vent holes 4, and the lower layer is the lower cavity 1-2 that completely penetrates the bottom of the stamp; the material of the bottom surface 3 of the stamp is the curing agent and the ratio of the body is 1:20 PDMS; the material of the magneti...

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Abstract

The invention discloses an air pressure regulated magnetic control film transfer printing stamp and a transfer printing method. The stamp is formed by assembling a stamp body, a magnetic film and a stamp bottom surface. The transfer printing method comprises the following steps of 1) during picking, applying a downward magnetic field to the stamp, enabling a magnetic film to generate downward deformation, pressing the stamp on a surface of a device, removing the magnetic field, enabling the magnetic film to rebound to generate negative pressure, applying a reverse magnetic field to the stamp,enabling the magnetic film to generate upward deformation to further increase the negative pressure, enabling a stamp / device interface to be in a strong adhesion state, and successfully picking the device; and 2) during printing, keeping the upward magnetic field and moving the stamp / device to an upper part of a substrate, removing the upward magnetic field and adding a stronger reverse magnetic field so that the magnetic film generates greater downward deformation to generate positive pressure, enabling the interface of the stamp / device to be in a weak adhesion state, and successfully printing the device. The stamp is low in cost; and by means of the method, non-contact transfer printing at a normal temperature can be achieved, high-efficiency global transfer printing can be achieved, andaccurate selective transfer printing can also be achieved.

Description

technical field [0001] The invention relates to a transfer printing technology, in particular to a magnetron thin film transfer stamp and a transfer printing method controlled by air pressure, which can be used for transfer printing of arbitrary patterned micro-nano electronic components. Background technique [0002] As a new type of material assembly technology, transfer printing technology can integrate different types of independently prepared discrete components on a large scale to form a spatially ordered functional system (see Luo Hongyu, Linghu Changhong, Song Jizhou. Extensible flexible A Review of Transfer Mechanics of Inorganic Electronic Devices [J]. Science in China: Physics, Mechanics and Astronomy, 2018(9).). Because of the rapid response and high integration efficiency of this technology, it is often applied to the integration and preparation of various electronic devices. For example, flexible and stretchable inorganic electronics that integrate rigid, hard...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/683H01L21/6838H01L2221/68363
Inventor 罗鸿羽王苏浩宋吉舟
Owner ZHEJIANG UNIV
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