Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Glue film punching and attaching device

A film, cutting and sticking technology, applied in metal processing and other directions, can solve the problems of low production efficiency, high mold manufacturing cost, and high labor consumption, and achieve the effect of improving production efficiency, reducing manufacturing cost, and improving the level of automation.

Inactive Publication Date: 2020-07-28
SUZHOU LINGYU ELECTRONICS TECH CO LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a film die-cutting and mounting device, which is provided with an upper mold and a lower mold, and is equipped with two feed passages for a metal workpiece and an adhesive film, and realizes the die-cutting and mounting operations of the adhesive film in the same mould. Realize continuous production, improve production efficiency, reduce manpower consumption, reduce mold manufacturing costs, and solve the problem that the punching and mounting of the existing film are carried out in different molds, resulting in low production efficiency, high mold manufacturing costs, and manpower consumption. more questions

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Glue film punching and attaching device
  • Glue film punching and attaching device
  • Glue film punching and attaching device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0054]refer to Figure 1 to Figure 12 , film punching and mounting device, including an upper mold 1 and a lower mold 2, the upper mold 1 is provided with a punch;

[0055] The lower mold 2 is provided with an X-axis feed channel 210 and a Y-axis feed channel 220, and the X-axis feed channel 210 is arranged below the Y-axis feed channel 220;

[0056] A support plate is provided at the intersection of the X-axis feed channel 210 and the Y-axis feed channel 220 , and the support plate is provided with a cutout matched with the punch.

[0057] To further illustrate, the intersection point is the position of the intersection of the X-axis feed channel 210 and the Y-axis feed channel 220 in the top view of the device.

[0058] To further illustrate, the support plate is located above the X-axis feed channel 210 and below the Y-axis feed channel 220 , and the cut...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a glue film punching and attaching device. The device comprises an upper die and a lower die, wherein the upper die is provided with a punch, the lower die is provided with anX-axis feed channel and a Y-axis feed channel, the X-axis feed channel is arranged below the Y-axis feed channel, the intersection of the X-axis feed channel and the Y-axis feed channel is provided with a support plate, and the support plate is provided with a notch matched with the punch. According to the device, the die is provided with two feed channels of metal workpieces and glue films, so that glue film punching and attaching operation can be realized in the same die, the continuous production is achieved, the production efficiency is improved, the manpower consumption is reduced, and the die manufacturing cost is lowered.

Description

technical field [0001] The invention relates to the technical field of film sticking, in particular to a film die-cutting and mounting device. Background technique [0002] The metal workpiece of 3C products, in addition to meeting the structural support and size of the product, also needs to have insulation or electrical conductivity requirements, so that it is convenient to mount die-cut films and other products with different functions on the metal workpiece. The assembly process is to punch the adhesive film after the die-cutting mold, and then transfer it to the mounting mold for mounting, and the metal workpiece is placed in the mounting mold in bulk for mounting operation, the production efficiency is low, and a lot of preparation is required. Set of molds, mold manufacturing costs are higher, and manpower consumption is also higher. Contents of the invention [0003] The purpose of the present invention is to provide a film die-cutting and mounting device, which i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B29C69/00B29C63/02B29C31/08B26F1/44
CPCB26F1/44B26F2001/4427B29C31/08B29C63/0004B29C63/02B29C69/001
Inventor 张嘉锋
Owner SUZHOU LINGYU ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com