Ultra-low flow resistance microchannel liquid-cooled heat exchanger based on elastic turbulence and its manufacturing method

Abstract

An ultra-low flow resistance microchannel liquid-cooled heat exchanger based on elastic turbulence and its manufacturing method, including a bonded and sealed heat dissipation bottom plate and a cover plate; the heat dissipation bottom plate is provided with a working fluid inlet and several microgrooves with periodic bending-variable cross-sections channel and working fluid inlet; the working fluid inlet is set at one end of the heat dissipation bottom plate, the working fluid outlet is set at the other end of the heat dissipation bottom plate, the liquid separation area is connected with the working fluid inlet, and one end of the periodically curved-variable cross-section micro channel is connected to the liquid separation The area is connected, and the other end is connected with the liquid collection area. The present invention utilizes the synergistic effect of the periodic bending-variable cross-section combined microchannel structure and the viscoelastic fluid, which can produce obvious elastic turbulence effect in the microchannel with low Re number, thereby significantly enhancing the heat transfer coefficient at low Re number. The invention does not need to increase the turbulence microcolumn and increase the flow velocity to form turbulent flow, so under the same heat exchange condition, the flow pressure drop and pump work consumption of the microchannel heat exchanger can be greatly reduced.

Description

technical field [0001] The invention belongs to ultra-high heat flux microchannel heat dissipation technology, relates to a high-efficiency and compact cooling technology suitable for ultra-high heat flux electronic components, and specifically relates to an ultra-low flow resistance microchannel liquid-cooled heat exchanger based on elastic turbulence and methods of manufacture thereof. Background technique [0002] With the rapid development of micro-nano manufacturing technology (MEMS), electronic components are characterized by high integration, high frequency and miniaturization. While the performance of electronic components is improving, the problem of heat generation has gradually become prominent, and has become the main bottleneck restricting its performance improvement after "Moore's Law". Studies have shown that more than 55% of electronic equipment fails due to overheating. In particular, the third-generation semiconductor devices represented by GaN materials ...

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problems of large flow resistance and high cost of enhanced heat transfer in the existing traditional microchannel liquid cooling heat dissipation technology, the purpose of the present invention is to provide a microchannel liquid cooling heat exchanger with ultra-low flow resistance based on elastic turbulence and its manufacturing method , the heat exchanger has significant advantages such as low flow resistance, high heat transfer coefficient, compact structure, easy realization and long-term stable operation.

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