Device for processing scratches on back surface of cutting blade

Abstract

The invention relates to the field of semiconductor processing, and discloses a device for processing scratches on the back surface of a cutting blade. The device comprises a horizontally-arranged rectangular workbench; a plurality of vertical supporting legs are arranged on the lower side of the workbench; a processing groove is formed in the workbench in a vertically penetrating manner; a U-shaped supporting frame fixedly connected with the workbench is arranged below the processing groove; a vertical main rotating shaft is rotationally connected onto the supporting frame; the main rotatingshaft is in transmission connection with a rotating driving mechanism; the cutting blade is fixed to the upper end of the main rotating shaft; the cutting blade is round; the axis of the cutting bladeis arranged vertically; a moving seat which can move longitudinally and corresponds to the processing groove is arranged on the workbench; a transverse movement seat which can move transversely is arranged on the moving seat; a tool seat which can move up and down is arranged on the transverse movement seat; a processing tool is mounted on the tool seat; the processing tool is corresponding to the cutting blade; and a loading and unloading mechanism corresponding to the workbench is arranged. By the aid of the device, the surface of the cutting blade can be conveniently ground flat, so that the reuse rate of the cutting blade is increased.

Description

technical field [0001] The invention belongs to the field of semiconductor processing, in particular to a device for treating scratches on the back of a cutting blade. Background technique [0002] In the prior art, the wafer is cut into multiple IC products after being cut horizontally and vertically for several times. The cutting machine used for wafer cutting has a rotating main shaft, and the main shaft is fixedly connected with a flange. The blue hole, the center hole of the cutting blade is fixedly connected with the flange through a bolt, the bolt passes through the center hole of the cutting blade and is threadedly connected with the center hole of the flange, and the bolt compresses the cutting blade to set. [0003] The main shaft flange of the cutting machine is a rigid part, and the blade is easy to wear because of the aluminum part. If the surface of the rigid flange is uneven, it will scratch the surface of the cutting blade. Scratches cause the cutting blade ...

AI Technical Summary

Problems solved by technology

[0003] The main shaft flange of the cutting machine is a rigid part, and the blade is easy to wear because of the aluminum part. If the surface of the rigid flange is uneven, it will scratch the surface of the cutting blade. Scratches cause the cutting blade not to fit well on the flange face

The non-fitting of the dicing blade and the flange surface will cause the knife mark produced when cutting the wafer to become wider, which is different from the normal wafer being cut and will affect normal cutting. Therefore, it will no longer be suitable for scratches on the surface of the dicing blade. For this wafer product, the dicing blade will not be put into use

The cutting blade cannot be used mainly due to scratches on the back of the blade. The current solution is: personnel manually use fine sandpaper to polish the scratches. Not only is the grinding efficiency low, but also there is a risk of damaging the peripheral edge of the cutting blade when grinding the blade. , if the blade is damaged, the personnel and the machine cannot detect the abnormality of the blade of the cutting blade, which will cause abnormalities in the cut IC products

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