Silver-based alloy bonding wire alloy material smelting equipment

Abstract

The invention provides silver-based alloy bonding wire alloy material smelting equipment, and relates to the field of binding wires. The silver-based alloy bonding wire alloy material smelting equipment comprises a vacuum smelting furnace body used for smelting an alloy material, an alloy smelting mechanism for smelting the alloy material and an alloy smelting and casting mechanism for performingpreliminary pouring on a molten alloy; and the bottom of the vacuum smelting furnace body is fixedly connected with supporting legs, and the top of the vacuum smelting furnace body is in an open state. According to the silver-based alloy bonding wire alloy material smelting equipment provided by the invention, according to the realistic problems existing in the smelting process of existing silveralloy bonding wire materials, a special smelting mechanism that can quickly separate solid and liquid in a layered state and continuously increase the smelting speed as metal changes is developed, andthe problems that a conventional smelting furnace is difficult to realize real-time solid-liquid separation when the smelting furnace is used, the direct transfer of temperature is influenced, materials are easily distributed unevenly due to the influence of the shape and materials during the smelting process, and the smelting efficiency is influenced are solved.

Description

technical field [0001] The invention relates to the technical field of bonding wires, in particular to a silver-based alloy bonding wire alloy material melting equipment. Background technique [0002] The bonding wire connects the silicon chip electrode and the external terminal of the lead frame, and transmits the chip's electrical signal and dissipates the heat generated in the chip. It is a key material for integrated circuit packaging. Wire bonding is the smallest feature size and the largest output in semiconductor production The concentrated expression of the former is manifested in the shrinking lead pitch, while the latter is reflected in the gradual increase in production efficiency. Ultra-fine pitch wire bonding requires connections with thinner wire diameters, higher strength and reliability. The control of air-free solder balls and the length of the heat-affected zone meets the needs of ultra-fine pitch bonding. Therefore, in large-scale integrated circuits and L...

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Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a silver-based alloy bonding wire alloy material smelting equipment, which solves the problem that it is difficult to realize real-time solid-liquid separation when the general smelting furnace is in use, which affects the direct transfer of temperature, and the material In the smelting process, affected by the shape and material, it is easy to distribute unevenly, which affects the efficiency of smelting

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