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Apparatus and Method for treating substrate

A substrate, liquid technology, applied in the field of membrane devices, can solve the problems of damage, a lot of smoke, expensive, etc.

Pending Publication Date: 2020-08-07
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the treatment fluids used to remove the film are usually more expensive than those used to clean the substrate
In addition, strong acidic chemicals can create large amounts of fumes during cleaning and can damage and contaminate surrounding equipment
In addition, strong acidic chemicals are used as the main environmental pollution factor because it is difficult to recycle strong acidic chemicals

Method used

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  • Apparatus and Method for treating substrate
  • Apparatus and Method for treating substrate
  • Apparatus and Method for treating substrate

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Embodiment Construction

[0025] Various modifications and changes may be made to the embodiments of the inventive concepts, and the scope of the inventive concepts should not be construed as being limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. Accordingly, in the drawings, the shapes of components are exaggerated for clarity of illustration.

[0026] In the following, reference will be made to Figure 1 to Figure 8 Embodiments of the inventive concept are described in detail.

[0027] figure 1 is a plan view illustrating a substrate processing apparatus according to an embodiment of the present inventive concept.

[0028] refer to figure 1 , the substrate processing apparatus 1 has an index module 10 and a processing module 20 . The index module 10 has a load port 120 and a transfer frame 140 . The load port 120, the transfer fr...

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PUM

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Abstract

The inventive concept provides an apparatus and method for removing a film formed on a substrate. A method for treating the substrate includes a primary solvent dispensing step of dispensing an organic solvent onto the substrate to remove a photoresist film on the substrate and an ozone dispensing step of dispensing liquid containing ozone onto the substrate to remove organic residue on the substrate, after the primary solvent dispensing step.

Description

technical field [0001] Embodiments of the inventive concepts described herein relate to an apparatus and method for treating a substrate with a liquid, and more particularly, to an apparatus and method for removing a film formed on a substrate. Background technique [0002] In order to manufacture a semiconductor element, a desired pattern is formed on a substrate through various processes such as photolithography, etching, ashing, ion implantation, thin film deposition, and the like. Over time, the processes become diverse and complex, thus generating pollutants and particles. Therefore, a cleaning process for cleaning the substrate is performed before and after each process. [0003] Generally, the cleaning process includes a process of removing a film formed on a substrate. However, it is not easy to remove the film due to its strong adhesion to the substrate surface. Therefore, a strong acid chemical such as sulfuric acid is used as a treatment liquid for removing the...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/67051H01L21/02057H01L21/67028H01L21/6708H01L21/67115H01L21/31133H01L21/02052H01L21/6704H01L21/683H01L21/6715H01L21/67276G03F7/34H01L21/0273
Inventor 金善美洪志守崔文植权五镇
Owner SEMES CO LTD