Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

PRECIPITATION HARDENING-TYPE Ag-Pd-Cu-In-B-BASED ALLOY

A precipitation hardening and alloying technology, which is applied in the field of precipitation hardening Ag-Pd-Cu-In-B alloys, can solve the problems of easy wear and easy breakage of contact probe pins, and achieve high reliability and stable mechanical strength and wear resistance effect

Active Publication Date: 2020-08-07
TOKURIKI HONTEN
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] From such a comprehensive point of view, Ag-Pd-Cu-based alloys are often used as materials for conventional contact probe pins. The shape of the front end is thinner and sharper, which may make the contact probe pins vulnerable to breakage and wear

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PRECIPITATION HARDENING-TYPE Ag-Pd-Cu-In-B-BASED ALLOY
  • PRECIPITATION HARDENING-TYPE Ag-Pd-Cu-In-B-BASED ALLOY
  • PRECIPITATION HARDENING-TYPE Ag-Pd-Cu-In-B-BASED ALLOY

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0056] Ag, Pd, Cu, In, and B were formulated into various desired compositions, and then an ingot (Φ15mm×L100mm) was produced by high-frequency melting. Table 1 describes the composition in each Example and Comparative Example. Note that Comparative Examples 19 and 20 show the composition of a conventional Ag-Pd-Cu-based alloy, and Comparative Example 21 shows the composition of a conventional Ag-Pd-Cu-In-based alloy.

[0057] Each composition was quantitatively analyzed, and In and unavoidable impurities which were the remainder of the composition were expressed as Balance (Bal.).

[0058] It should be pointed out that the production method of the ingot based on the present invention is not limited to high-frequency melting, for example, any melting method established now and in the future such as gas melting, electric furnace, vacuum melting method, continuous casting method, and zone melting method can be applied to this invention.

[0059] Table 1

[0060]

[0061] N...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Vickers hardnessaaaaaaaaaa
electrical resistivityaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

Provided is an alloy with superior overall balance and a higher hardness than before, and which exhibits good contact resistance stability (oxidation resistance) and plastic workability while maintaining a low level of resistivity comparable at least with that of a conventional Ag-Pd-Cu alloy. This precipitation hardening-type alloy comprises 17-23.6 at% of Ag, 0.5-1.1 at% of B, and a total of 74.9-81.5 at% of Pd and Cu, wherein the atomic percentage ratio between the Pd and the Cu is 1:1 to 1:1.2 and the balance comprises In and incidental impurities.

Description

technical field [0001] The present invention relates to alloys suitable for components and / or parts such as connectors, terminals, electrical contacts, contact probes and the like for use in electrical and / or electronic equipment. Background technique [0002] The IC test socket is composed of a plurality of contact probe pins arranged on the substrate. The IC test base plays the role of connecting the electrodes of semiconductor components such as IC (Integrated Circuit) and the inspection device (testing machine) to be inspected, and is used for Its electrical check. [0003] Electrical inspection of IC (Integrated Circuit) is sometimes performed at room temperature, but depending on the application of IC (Integrated Circuit), it may be performed in a high temperature environment (for example, 120 to 160° C.) in which the environment in which it is expected to be used is sometimes performed. [0004] As materials for such contact probe pins, for example, Re-W-based alloy...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C22C5/04C22C30/02G01R1/067
CPCC22C5/04C22C30/02G01R1/06755C22C9/08G01R1/067
Inventor 宍野龙
Owner TOKURIKI HONTEN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products