Unlock instant, AI-driven research and patent intelligence for your innovation.

Progressive baking and heating device

A heating device, progressive technology, applied in the direction of transportation and packaging, conveyor objects, electrical components, etc., can solve problems such as warping and debris, achieve the effect of avoiding warping, avoiding external impact, and improving baking quality

Inactive Publication Date: 2020-08-11
宁波润华全芯微电子设备有限公司
View PDF9 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the above-mentioned defects existing in the prior art, and proposes a progressive baking heating device, which solves the problem that the existing baking heating device has a certain temperature difference between the inside and the outside of the heating device during the baking process. When the temperature changes sharply, the wafer material is prone to different degrees of warping, and it may be directly fragmented under the external temperature change or external force.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Progressive baking and heating device
  • Progressive baking and heating device
  • Progressive baking and heating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A progressive baking heating device according to the embodiment of the present invention, such as figure 1 , 2 , shown in 3: comprise base plate 9, be provided with heating mechanism 1, drive mechanism 7, hoisting mechanism on the base plate 9, drive mechanism drives hoisting mechanism, and hoisting mechanism drives supporting plate to do progressive lifting motion. Specifically, the lifting mechanism includes a side plate 10, the upper end of the side plate 10 is fixedly connected with a fixed seat 12, the fixed seat 12 is rotatably connected with a pulley 13, the side plate 10 is provided with a linear guide rail 11, and the linear guide rail 11 is slidably connected with a Sliding seat 15, drive mechanism 7 is fixedly installed on the sliding seat 15, is fixedly connected with rotating cylinder on the driving mechanism 7, is connected with belt 14 on the rotating cylinder, and belt 14 is wound on the pulley 13, is fixedly connected with on the sliding seat 15 The su...

Embodiment 2

[0031] In this embodiment, compared with Embodiment 1, the disk cover 3 is provided with a disk cover 2 . The disk cover 2 is convenient for observing the wafer in the heating disk 5 ; and the fixed seat 12 is provided with a belt seat 19 , and the belt 14 passes through a pair of belt holes on the belt seat 19 . The belt seat 19 plays the role of stabilizing the belt 14, further improving the precision of wafer lifting control.

Embodiment 3

[0033] The embodiment of the present invention is basically the same as Embodiments 2 and 3, except that the lifting mechanism in the embodiment of the present invention is specifically that the fixed seat 12 is rotatably connected with a sprocket, and the side plate 10 is provided with a linear guide rail 11, and the linear guide rail 11 The upper slide is connected with a sliding seat 15, and the driving mechanism 7 is fixedly installed on the sliding seat 15. There is a supporting plate 17 on which a thimble 18 is fixedly connected. The supporting plate 17 is located below the heating mechanism 1 , and the thimble 18 extends into the heating mechanism 1 . When heating, the heating plate 5 is set at a certain temperature, and the manipulator places the wafer on the thimble 18. The servo motor 16 in the drive mechanism 7 drives the pallet 17 and the thimble 18 to drop slowly under the action of the chain transmission, and the temperature of the wafer gradually decreases. incr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a progressive baking and heating device, and relates to the technical field of wafer processing. The device comprises a heating mechanism, a driving mechanism, a lifting mechanism, a supporting plate, a thimble and a supporting plate connecting thimble, wherein the thimble extends into the heating mechanism, the driving mechanism drives the lifting mechanism, and the lifting mechanism drives the supporting plate to do progressive lifting motion. According to the invention, under the driving of the driving mechanism and the lifting mechanism, a wafer can be stopped at different heights, so that continuous and stable temperature rising and falling in the baking process can be guaranteed, the wafer can be prevented from being subjected to external impact in the risingand falling process, and the problems that a thin wafer warps and is broken in the baking process are solved fundamentally; and the progressive baking and heating device is simple in structure, convenient to use, practical and capable of effectively improving the wafer baking quality.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a progressive baking heating device. Background technique [0002] The existing wafer processing equipment is disclosed by the following patents. Chinese invention patent specification CN 105470187 B (published on April 6, 2016) discloses a lifting plate device for preventing wafer sliding, including a fixed cover, a lifting plate Body, thimble mechanism and lower fixed plate, fixed cover and thimble mechanism are respectively installed on the lower fixed plate, the lifting plate body is located between the fixed cover and thimble mechanism, including heating plate body, outer sealing body, power device and stop pin, power device Installed on the fixed plate to drive the outer sealing body up and down. The heating plate is placed in the outer sealing body and rises and falls with it. There are a number of stop pins evenly distributed on the upper surface of the heating p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67103H01L21/67248H01L21/67706H01L21/67742H01L21/67751
Inventor 耿克涛刘金
Owner 宁波润华全芯微电子设备有限公司