Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A chip contact socket structure

A contact and hole structure technology, applied in the direction of contact parts, fixed/insulated contact components, parts of connection devices, etc., can solve problems such as increasing retention force and number of contacts, low assembly and production efficiency, and complex processing technology , to achieve the effect of increasing the holding force, reliable connection and wide application range

Active Publication Date: 2021-10-26
CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to propose a socket structure of a chip contact, which solves the technical problems of complex processing technology, high cost, low assembly and production efficiency of the socket structure of the chip contact, and also increases the plug-in connection with the chip contact pin. Retention force and number of contacts when

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A chip contact socket structure
  • A chip contact socket structure
  • A chip contact socket structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The technical solutions of the present invention will be further described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0032] Such as Figure 1 to Figure 7 As shown, the socket structure of the chip contact piece of the present invention includes a circlip 1 and a chip contact assembly 2 installed in the circlip socket 11 and both ends of which can be mated with the adapter chip pins. And the reeds 3 located on the upper and lower surfaces of the leaf contact assembly, the reeds are provided with two and symmetrically distributed, used to increase the number of contact contacts with the adapter sheet pins; the leaf contact assembly 2 includes two symmetrically spliced In this embodiment, both sides of the middle part of the sheet contact are bent to form the contact portion 4, and the two contact portions abut against each other through the end planes of the contact portion. The front end of the chip contact assembly is pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A chip contact socket structure, including a circlip, a chip contact assembly installed in the circlip socket and both front and rear ends are used for mating with the adapter chip pin, and symmetrically installed on the chip contact For the reeds on the upper and lower surfaces of the component, the front end of the sheet contact assembly is oppositely provided with a plurality of first claws arranged at intervals along the width direction of the sheet contact assembly, and the rear end is oppositely provided with a conductive clip; the front end of the reed has a The second spring claw between the first spring claws and the second spring claw is in conductive contact with the blade pin, and the rear end has a third spring claw which is placed in the through hole opened on the conductive clip and is in conductive contact with the blade pin. The present invention adopts the steel-clad copper type double reed structure, which is convenient for processing and assembling. Compared with the existing single reed structure, the contact point and contact retention force with the adapter pin are increased, and the electrical connection is improved. Stability, especially suitable for high frequency vibration environment.

Description

technical field [0001] The invention belongs to the technical field of electrical connectors, and in particular relates to a socket structure of a sheet contact piece. Background technique [0002] In the electrical connector industry, the contact has always been the most important part of the connector, which is directly related to the reliability of the connector's connection performance. Most of the contacts used at this stage are pin sockets, and the processing technology of pin socket contacts is complicated, the production cost is high, and the current carrying capacity is limited, so it is increasingly unable to meet the market demand for high-current connectors; and Under the same flow capacity, the chip contact connector is smaller than the pin socket connector, so the chip contact connector can better meet the market demand of high performance and low cost. At present, the commonly used structure is to process the circlip into a structure that is easy to place the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/187H01B1/02H01R13/639H01R13/533H01R13/502H01R13/24H01R13/40
CPCH01B1/02H01R13/187H01R13/2428H01R13/40H01R13/502H01R13/533H01R13/639
Inventor 李刘生韩见强郭辉李昊张鹏飞怀小宝何德禄
Owner CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com