Processing method of sound hole of MEMS carrier plate

A processing method and sound hole technology, which is applied in the field of sound hole processing, can solve problems such as the deterioration of sound hole and graphic accuracy, affect the quality of sound holes, and waste costs, so as to improve processing accuracy, control the quality and roughness of sound holes controllable effect

Inactive Publication Date: 2020-08-14
JIANGSU PROVISION ELECTRONICS CO LTD
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Problems solved by technology

[0004] However, for the above-mentioned first processing technology, when the designed sound hole is located at the blind groove, then when performing laser grooving, because there are through holes (acoustic holes) in the area where the groove needs to be burnt, the energy will pass through the through hole and damage the Hole

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  • Processing method of sound hole of MEMS carrier plate
  • Processing method of sound hole of MEMS carrier plate
  • Processing method of sound hole of MEMS carrier plate

Examples

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[0025] Example 1:

[0026] The present invention provides a method for processing the sound hole of a MEMS carrier board, which includes the following steps: Step 1). Prepare a MEMS carrier board. figure 1 As shown, the MEMS carrier board includes a core board 1, two first copper layers 2 and two second copper layers 3. The core board 1 consists of two inner copper layers 10 passing through an inner insulating layer located in the middle. 11 is formed by pressing and compounding, each of the two first copper layers 2 is pressed on the surface of the two inner copper layers 10 through a first insulating layer 4, and the two second copper layers 3 are respectively pressed Press-fitting on the surfaces of the two first copper layers 2 through a second insulating layer 5;

[0027] Step 2). Perform a laser window opening operation on one of the second copper layers 3 according to the wiring layout requirements to form a window 30 that can expose a partial surface of the second insulatin...

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Abstract

The invention discloses a processing method of a sound hole of an MEMS carrier plate. The method comprises the following steps: preparing an MEMS carrier plate, wherein the MEMS carrier plate comprises a core plate formed by laminating and compounding two inner copper layers and an inner insulating layer, two first copper layers laminated on the surfaces of the two inner copper layers through a first insulating layer respectively, and two second copper layers laminated on the surfaces of the two first copper layers through a second insulating layer respectively; performing laser windowing on the second copper layers to form a window capable of exposing a local surface of the second insulating layer; performing laser ablation grooving on the exposed surface area of each second insulating layer, and processing a blind groove capable of penetrating through the second insulating layer and the first insulating layer; and carrying out laser hole cutting on the MEMS carrier plate and at the position corresponding to the bottom of the blind groove, and processing a sound hole with one end communicated with the blind groove and the other end penetrating through the other second copper layer. The sound hole processing method has the advantages of being simple, easy to operate, high in operation precision, high in machining efficiency and the like, and the sound hole quality is guaranteed.

Description

technical field [0001] The invention relates to the technical field of circuit board production, and specifically provides a method for processing an acoustic hole of a MEMS carrier board. Background technique [0002] With the development of electronic technology and people's requirements for miniaturization and high integration of electronic products, in order to reduce the volume of the carrier board and increase the utilization rate of space, blind slot products have emerged as the times require. [0003] In the existing technology, the processing technology of blind groove and sound hole mainly adopts: the first processing technology: first perform mechanical drilling (sound hole) operation, then perform laser groove window opening operation, and then perform CO2 laser groove burning operation; or , the second processing technology: first carry out the laser groove window opening operation, then carry out the CO2 laser groove burning operation, and then carry out the X-...

Claims

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Application Information

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IPC IPC(8): H05K3/00B81C1/00
CPCH05K3/0026B81C1/00087B81C1/00547H05K2203/107
Inventor 马洪伟宗芯如杨飞
Owner JIANGSU PROVISION ELECTRONICS CO LTD
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