Expansion mold for heat treatment of electronic connector contact head

Abstract

The invention discloses an expanding mold for heat treatment of a contact head of an electronic connector, which comprises a bottom plate, one side of the bottom plate is connected with a square iron, the other side of the bottom plate is connected with a mounting seat, both sides of the bottom plate are connected with guide blocks, and the bottom plate is connected with a Bottom wear-resistant block, the surface of the bottom wear-resistant block is slidingly connected with a slider seat, the left side of the slider seat is provided with a card slot, the right side of the slider seat is provided with two installation slots, and the center of the installation slot is provided with a T-shaped hole. A T-shaped connecting rod is installed in the T-shaped hole, and the installation groove is connected with a limit block. The T-shaped connecting rods on both sides are connected with a pull plate, the pull plate is connected with a mandrel, the mandrel is connected with a guide seat, and the guide seat is connected with an expansion mold core. , the left side of the expansion core is slidingly connected with a cover plate, the right side of the expansion core is slidingly connected with a pressure block, the pressure block is connected with a compression spring, the mounting seat is connected with a limit sleeve on the outside of the mandrel, and the square iron is connected with the top of the mounting seat. A support block, the top of the support block is connected with a panel, the panel is connected with a cylinder, the power output end of the cylinder is connected with a connector, and the connector is connected with a shovel base.

Description

technical field [0001] The invention belongs to the technical field of expansion molds, in particular to a expansion mold for heat treatment of contact heads of electronic connectors. Background technique [0002] The contact head of the electronic connector is a shaft part with a central hole. The contact head of the electronic connector is plugged with other parts for use. Therefore, expansion is required. The expansion is forced to reduce the thickness of the blank under the action of the mold. Stamping method of thinning and increasing surface area to obtain part geometry. The bulging process is different from the deep drawing process. The plastic deformation zone of the blank is limited to the deformation zone, and the material does not transfer to the outside of the deformation zone, nor enter the deformation zone from the outside. It is realized by the local thinning of the blank. The existing The structure of the expansion mold is cumbersome, there are many auxiliar...

AI Technical Summary

Problems solved by technology

The bulging process is different from the deep drawing process. The plastic deformation zone of the blank is limited to the deformation zone, and the material does not transfer to the outside of the deformation zone, nor enter the deformation zone from the outside. It is realized by the local thinning of the blank. The existing The structure of the expansion mold is cumbersome, there are many auxiliary processes, and the production efficiency is not high. In addition, during the expansion operation, the contact head of the electronic connector set on the expansion mold has no fixed position, so it is easy to shift, resulting in expansion. Post-oral waste of raw materials

Images