Heat dissipation assembly, backlight source assembly and display device

A technology of heat dissipation components and display devices, which is applied in the direction of identification devices, electrical components, and structural parts of electrical equipment, etc., which can solve the problems of poor heat dissipation of display products and achieve the effect of reducing heat accumulation

Active Publication Date: 2020-08-21
K TRONICS (SUZHOU) TECH CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the shortcomings of the existing methods, this application proposes a heat dissipation assembly, a backli

Method used

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  • Heat dissipation assembly, backlight source assembly and display device
  • Heat dissipation assembly, backlight source assembly and display device
  • Heat dissipation assembly, backlight source assembly and display device

Examples

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Embodiment Construction

[0031] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0032] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

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Abstract

The embodiment of the invention provides a heat dissipation assembly, a backlight source assembly and a display device. The heat dissipation assembly comprises a heat conduction structure and a heat dissipation structure, one side of the heat conduction structure is in heat conduction connection with a heat source, and the other side of the heat conduction structure is in heat conduction connection with one side of the heat dissipation structure. At least one side surface, far away from the heat conduction structure, of the heat dissipation structure is an anodized surface. The heat conductionconnection bridge is established between the heat source and the heat dissipation structure through the heat conduction structure, heat at the heat source can be rapidly conducted to the heat dissipation structure, and heat accumulation at the heat source is reduced; the heat dissipation structure is not in direct heat conduction connection with a heat source, so that the heat dissipation structure is flexibly arranged, and influence on the original structural design of the display product is greatly reduced; the anodized surface of the heat dissipation structure is provided with a large number of micropores, the heat radiation area can be increased, and therefore the heat radiation efficiency is improved.

Description

technical field [0001] The present application relates to the field of display technology, and in particular, the present application relates to a heat dissipation component, a backlight source component and a display device. Background technique [0002] Many components of the display product will generate a lot of heat during operation. If the heat dissipation is not good, the performance of the display product will be reduced, and in severe cases, the related components will even be burned. [0003] In order to meet the increasing visual demands of consumers, display products are developing in the direction of high brightness, high contrast, ultra-thin, narrow bezel, and no bezel. The power of the relevant components of the display product is higher, resulting in at least a greater local heat generation; the structure of the display product is more compact, resulting in heat accumulation and difficulty in dissipating. [0004] Therefore, Cheng waited to solve the technic...

Claims

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Application Information

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IPC IPC(8): H05K7/20G09F9/00
CPCH05K7/20954G09F9/00Y02D10/00
Inventor 林荣辉
Owner K TRONICS (SUZHOU) TECH CO LTD
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