Thin-wall curved surface surface pattern laser processing track solving method

A technology for processing trajectories and curved surfaces, applied in image data processing, details involving processing steps, complex mathematical operations, etc., can solve complex and time-consuming problems

Active Publication Date: 2020-08-25
DALIAN UNIV OF TECH
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Problems solved by technology

However, this method is only suitable for large thin-walled skin surface workpieces whose deformation is mainly along the normal direction, and the surface matching algorithm requires a large number of iterative calculations, which is complicated and time-consuming

Method used

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  • Thin-wall curved surface surface pattern laser processing track solving method
  • Thin-wall curved surface surface pattern laser processing track solving method
  • Thin-wall curved surface surface pattern laser processing track solving method

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Embodiment Construction

[0120] The specific implementation manner of the present invention will be described in detail in conjunction with the technical scheme and the accompanying drawings.

[0121] Embodiment: The selected material is 6061 aluminum alloy, the elastic modulus of the material is 71700MPa, the Poisson's ratio is 0.33, the outer diameter of the thin-walled cylindrical part is 0.098m, the height is 0.15m, and the thickness is 0.001m, and the seven-leaf plum blossom curve is processed on its surface , the implementation process of the present invention will be described in detail below.

[0122] Thin-wall curved surface parts have low rigidity, and are prone to elastic deformation in the clamped state. During the process of surface pattern processing on thin-wall curved surfaces, it is easy to cause pattern curve processing errors. To solve this problem, a laser processing track for surface patterns on thin-wall curved surfaces is invented. The solution method, the overall process of the...

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Abstract

The invention belongs to the technical field of thin-wall curved surface layer pattern precision manufacturing, and relates to a thin-wall curved surface layer pattern laser processing track solving method. According to the method, clamping state curved surface point cloud data are obtained through a three-coordinate measuring machine according to the clamping deformation characteristics of the thin-wall curved surface part and mapped to an ideal curved surface in the radial direction, the mapping relations between the clamping state curved surface and an ideal curved surface triangular mesh are constructed, and the mapping track of an ideal machining track on the clamping state curved surface is solved. A model is predicted according to laser ablation size; and discretizing solving is performed on the ablation depth and the ablation width of the material at any cutter location point on the mapping track, instantaneous machining parameter change caused by surface curvature change is considered and local machining track point adjustment is made on the out-of-tolerance position of the pattern curve size or contour to finally generate a five-axis numerical control machining track conforming to the machining precision. The method reduces machining errors caused by clamping deformation, and is suitable for precision machining of thin-wall curved surface surface patterns.

Description

technical field [0001] The invention belongs to the technical field of precision manufacturing of thin-wall curved surface surface patterns, and relates to a method for solving laser processing tracks of thin-wall curved surface surface patterns. Background technique [0002] With the development of aerospace, information transmission and other fields, the integrated components with complex curved surface structure and function required for electromagnetic wave transmission control have gradually become an important component form. Antennas for high-speed aircraft are an important application of such components. In order to meet the requirements of high performance and light weight, antennas mostly use light-weight materials with thin-walled curved surface substrate structures, and the processing accuracy requirements are generally at the micron level. New processing technologies are proposed. challenge. The high-efficiency and high-precision manufacturing of complex patter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/23G06F17/11G06T17/20
CPCG06F30/23G06F17/11G06T17/20G06T2200/08
Inventor 马建伟姜文文贾振元韩东旭王健王福吉刘巍
Owner DALIAN UNIV OF TECH
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