Semiconductor structure

Abstract

The invention discloses a semiconductor structure including a substrate, plural contact structures on the substrate, a group of first patterns which are above the contact structures and comprise a plurality of first curve patterns, and a group of second patterns, wherein the second patterns and the first patterns are positioned on the same plane, the second patterns comprises a plurality of secondcurve patterns, and the plurality of first curve patterns and the plurality of second curve patterns are intersected with each other from an upper view.

Description

technical field [0001] The invention relates to a semiconductor structure, especially a dynamic random access memory structure with kite-shaped storage point contact pads. Background technique [0002] Due to the high-density development of semiconductor components, the size of components within a unit area is continuously reduced. Semiconductor components are widely used in the electronics industry due to their small size, versatility and / or low manufacturing cost. Semiconductor components are divided into semiconductor components that store logic data, semiconductor logic components that operate and process logical data operations, or hybrid semiconductor components that simultaneously have the functions of semiconductor storage components and semiconductor logic components and / or other semiconductor components. [0003] A semiconductor assembly may generally include vertically stacked patterns, and contact plugs electrically connecting the stacked patterns to each other....

AI Technical Summary

Problems solved by technology

Parasitic capacitance may lead to performance degradation of semiconductor components (e.g., reduced operating speed)

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