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Preparation process of heat-conducting wave-absorbing coiled tape and finished product thereof

A preparation process and heat-conducting coating technology, which is applied in the field of heat-conducting and wave-absorbing materials, can solve the problem that heat-conducting and wave-absorbing membranes are difficult to take into account high heat conduction and low-frequency electromagnetic wave absorption, and achieve separation and controllable electromagnetic wave filtering frequency reduction and separation controllable The effect of improving thermal conductivity

Active Publication Date: 2020-08-25
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Description
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  • Application Information

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Problems solved by technology

[0008] The main purpose of the present invention is to provide a preparation process of heat-conducting and wave-absorbing tape. The main progress lies in the combination of manufacturing process and multi-layer structure to solve the problem that the heat-conducting wave-absorbing film is difficult to take into account high heat conduction and low-frequency electromagnetic wave absorption. The process improvement lies in the back-end process of the absorbing material diaphragm

Method used

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  • Preparation process of heat-conducting wave-absorbing coiled tape and finished product thereof
  • Preparation process of heat-conducting wave-absorbing coiled tape and finished product thereof
  • Preparation process of heat-conducting wave-absorbing coiled tape and finished product thereof

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Embodiment Construction

[0052] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only part of the embodiments for understanding the inventive concepts of the present invention, and cannot represent All the embodiments are not explained as the only embodiment. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art on the premise of understanding the inventive concepts of the present invention fall within the protection scope of the present invention.

[0053] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the relationship between the components in a certain posture. If the specific postu...

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Abstract

The invention relates to a preparation process of a heat-conducting wave-absorbing coiled tape and a finished product thereof. The preparation process sequentially comprises the steps of providing a wave-absorbing core film with a wave cut-off through hole, and determining the wave-absorbing performance; forming heat-conducting slurry on the upper and lower surfaces of the wave-absorbing core film; forming a multi-layer tape body by rolling or blade coating, and determining the heat-conducting property and the film-forming thickness; and heating and vulcanizing the upper and lower film-formingheat-conducting slurry. The upper and lower heat-conducting slurries are gathered and integrally connected to a wave cut-off through hole to form a heat-conducting channel. The above steps are continuously carried out in a step of introducing and winding a primary winding tape of the wave-absorbing core film. The preparation process has the effects that the separation controllable electromagneticwave filtering frequency is reduced, the separation controllable thermal conductivity is improved and the film forming thickness can be adjusted in the manufacturing process through one-stop continuous production.

Description

technical field [0001] The invention relates to the technical field of preparation of heat-conducting and wave-absorbing materials for electronic materials, in particular to a preparation process of heat-conducting and wave-absorbing tape and its finished product. Background technique [0002] In the prior art, there are diaphragm-shaped heat-conducting and wave-absorbing materials, which can be divided into a multi-layer structure with separate functions and a multi-functional single-layer integrated structure. Although it is called heat conduction and wave absorption, its thermal conductivity is generally below 3 W / (m K). If it is a multi-layer structure with separate functions, under the thermal barrier of the wave-absorbing material layer, the vertical thermal conductivity of the surface will be worse. On the one hand, in order to improve the thermal conductivity, the conventional method is to change the ratio of the thermal conductivity material. When the thermal condu...

Claims

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Application Information

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IPC IPC(8): H05K9/00B32B3/24B32B25/20B32B25/14B32B27/40B32B27/38B32B27/30B32B27/18B32B7/06B32B33/00
CPCH05K9/009B32B3/266B32B25/20B32B25/14B32B27/40B32B27/38B32B27/308B32B27/18B32B7/06B32B33/00B32B2255/10B32B2255/26B32B2307/302
Inventor 窦兰月王自领
Owner SHENZHEN HFC SHIELDING PRODS CO LTD