Novel film laminating forming process for aluminum-based copper-clad plate

A technology of aluminum-based copper clad laminate and forming process, applied in electronic equipment, lamination, application, etc., can solve problems such as low production efficiency

Inactive Publication Date: 2020-08-28
SHENZHEN CHUANGHUI ALLIANCE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a new aluminum-based copper-clad laminate coating forming process, which is used to solve the problems of the current copper plate coating forming process: independent manual cutting process, manual leveling process, manual film coating process, and low production efficiency. question

Method used

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  • Novel film laminating forming process for aluminum-based copper-clad plate
  • Novel film laminating forming process for aluminum-based copper-clad plate
  • Novel film laminating forming process for aluminum-based copper-clad plate

Examples

Experimental program
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Effect test

Embodiment 1

[0091] The embodiment of the present invention provides a novel aluminum-based copper clad laminate film forming process, such as Figure 1-3 Shown, including successively:

[0092] Step 1: The aluminum substrate 81 is transferred to the positioning device 1 for positioning;

[0093] Step 2: The positioned aluminum substrate 81 is transferred to the dust removal device for dust removal;

[0094] Step 3: The dust-removed aluminum substrate 81 is transferred to the automatic laminating device 9 for laminating;

[0095] Step 4: The coated aluminum substrate 81 is transferred to the automatic leveling device 4 for leveling;

[0096] Step 5: The leveled aluminum substrate 81 is transferred to the automatic cutting device 5 for cutting, and the finished aluminum plate 8 is formed.

[0097] Such as figure 2 As shown, the finished aluminum plate 8 includes: a protective film 82, an aluminum plate 811, and a copper 812 with glue, which are sequentially arranged from bottom to top;

[0098] Such a...

Embodiment 2

[0109] Such as figure 1 As shown, on the basis of the embodiment 1:

[0110] The automatic leveling device 4 includes: a horizontal leveling device 414 and a longitudinal leveling device 424; the automatic cutting device 5 includes: a horizontal positioning cutting device 51 and a longitudinal positioning cutting device 52;

[0111] The step 4 includes: performing horizontal leveling by the horizontal leveling device 414, and then after being turned by the first steering device 6, and then transferred to the longitudinal leveling device 424 for longitudinal leveling; preferably, the first steering device and the second 2. The steering device is a steering roller;

[0112] Said step 5: including: after the longitudinally leveled aluminum substrate 81 is turned by the first turning device 6, it is transferred to the horizontal positioning and cutting device 51 for horizontal positioning and cutting, and then to the vertical positioning and cutting device 52 for longitudinal positioning...

Embodiment 3

[0115] On the basis of embodiment 1 or 2, such as Figure 4 As shown, the positioning device 1 includes:

[0116] Fixed seat 11;

[0117] A plurality of triangular pillars 12 are movably installed on the fixed seat, and the plurality of triangular pillars 12 are symmetrically arranged on both sides of the aluminum substrate 81, and the tips of the triangular pillars 12 face the aluminum substrate 81;

[0118] The driving device 13 is connected to the triangular cylinder 12, and is used to drive the tip of the triangular cylinder 12 to approach the aluminum substrate and position the aluminum substrate; preferably, the driving device is an electric cylinder (or an electric hydraulic or pneumatic cylinder) or an electric Telescopic rod, used to drive the linear movement of the triangular column;

[0119] The sliding groove 111 is arranged at the top of the fixing base 11;

[0120] The sliding block 14 is fixedly connected to the non-tip at the bottom end of the triangular column body 12,...

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Abstract

The invention provides a novel film laminating forming process for an aluminum-based copper-clad plate. The process comprises the steps that 1, an aluminum substrate is conveyed to a positioning device to be positioned; 2, the positioned aluminum substrate is conveyed to a dust removal device to be subjected to dust removal; 3, the aluminum substrate subjected to dust removal is conveyed to an automatic film laminating device to be laminated; 4, the aluminum substrate laminated is conveyed to an automatic leveling device to be leveled; and 5, the leveled aluminum substrate is conveyed to an automatic cutting device to be cut, and a finished aluminum plate is formed. The aluminum substrate is automatically conveyed to the automatic film laminating device, the automatic leveling device and the automatic cutting device in sequence, the film laminating process, leveling and cutting are integrated into a complete full-automatic process, the labor requirement is reduced, and the efficiency is high. The positioning device is additionally arranged before film covering, so that deviation is avoided; and dust removal is conducted before film covering, thus avoiding direct film covering without dust removal, which may cause a problem that dust and impurities are easily adsorbed by a protective film due to the electrostatic effect, and an aluminum surface is easily crushed and scrapped during client punching plate forming.

Description

Technical field [0001] The invention relates to the technical field of aluminum-based copper-clad laminate molding technology, in particular to a novel aluminum-based copper-clad laminate film molding technology. Background technique [0002] At present, aluminum-based copper clad laminates are formed on the market, and the laminating process is three independent processes. The three processes cannot be perfectly combined. This process is first cut and formed, then leveled, and finally laminated. This cutting is relatively neat , But the film cannot be fully automatic; in addition, it is time-consuming and low-efficiency defects that the film is leveled first, and then the film is repaired manually. [0003] Now that the aluminum-based copper clad laminates on the market are pressed and cured, there are copper skins and thermal conductive glue on all four sides of the metal substrate. When the film is directly coated, the protective film is easy to absorb dust and debris due to the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B37/00B32B38/00B32B38/16B32B41/00H05K3/02
CPCB32B37/0007B32B37/10B32B38/0004B32B38/162B32B41/00B32B2041/04B32B2457/08H05K3/022
Inventor 吴国庆江奎何新荣叶鹏飞
Owner SHENZHEN CHUANGHUI ALLIANCE TECH
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