Grabbing robot equipment with silicon wafer transportation and dust removal functions

Abstract

The invention discloses grabbing robot equipment with silicon wafer transportation and dust removal functions. The grabbing robot equipment comprises a main body, a working area is arranged outside the main body, the main body can move left and right in the working area, a linkage cavity is formed in the main body, a linkage motor is fixedly arranged in the linkage cavity, rotating rods are symmetrically arranged at the left end and the right end of the linkage motor in a power connection mode, and a driving bevel gear is fixedly arranged on the portion, located in the linkage cavity, of an outer circle face of the rotating rod on the right side. According to the equipment, a silicon wafer is transported after dust removal, the silicon wafer is fixed through a suction disc firstly, dust onthe surface of the silicon wafer is removed by blowing through a dust removal opening, the left and right ends of the silicon wafer are clamped and turned over through robot arms, dust on the back face of the silicon wafer is removed, the robot arms drive the silicon wafer to rotate in the moving process to achieve the comprehensive dust removal effect, dust diffusion is prevented through air suction of dust suction openings in the two sides, and the silicon wafer is prevented from being secondarily contaminated.

Description

technical field [0001] The invention relates to the technical field of robot grabbing equipment, in particular to a robot grabbing equipment with the functions of transporting and removing dust for silicon wafers. Background technique [0002] In industrial production, silicon wafers are widely used in the manufacture of integrated circuits. After cutting and grinding the traces on the surface, silicon wafers are etched with millions of transistors to achieve various functions, and transistors are small and fragile. There should be no dust or pollution on the surface of the wafer, and the cleaning before etching becomes particularly important. Most of the existing technology works in a clean room where workers wear clean clothes, which increases various costs. The present invention illustrates a device capable of solving the above-mentioned problems. Contents of the invention [0003] Technical problem: Before etching transistors, silicon wafers are mostly in the ultra-cl...

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Problems solved by technology

[0002] In industrial production, silicon wafers are widely used in the manufacture of integrated circuits. After cutting and grinding the traces on the surface, silicon wafers are etched with millions of transistors to achieve various functions, and transistors are small and fragile. There should be no dust or pollution on the surface of the wafer. Cleaning before etching becomes particularly important. Most of the existing technologies work in ultra-clean room workers wearing clean clothes, which increases various costs.

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