Thermosetting resin composition, and bonding sheet, metal foil-clad laminated board and printed circuit board manufactured by using thermosetting resin composition

Abstract

The invention provides a thermosetting resin composition, and a bonding sheet, a metal foil-clad laminated board and a printed circuit board manufactured by using the thermosetting resin composition,and relates to the technical field of thermosetting resin. The thermosetting resin composition comprises the following components in parts by mass: 20-90 parts of allyl ether resin with a polyalicyclic structure and 10-80 parts of a multifunctional vinyl aromatic copolymer. According to the thermosetting resin composition, the allyl ether resin with a polyalicyclic structure is matched with the multifunctional vinyl aromatic copolymer to form a main resin system; according to the present invention, the two components are subjected to copolymerization to form the good network interpenetrating structure, such that the material cured by the resin composition has characteristics of low dielectric constant, low dielectric loss and ultra-low high frequency signal transmission loss, can meet thedielectric property requirement of the region with the frequency of more than or equal to 10 GHz, and has broad application prospects in the field of high frequency transmission.

Description

technical field [0001] The invention relates to the technical field of thermosetting resins, in particular to a thermosetting resin composition and an adhesive sheet, a metal foil-clad laminate and a printed circuit board made of the thermosetting resin composition. Background technique [0002] Mobile communication equipment represented by 5G communication, base stations, servers, routers and other network infrastructure equipment, as well as the high-speed and large-capacity signals used for data storage and computing, are rapidly advancing year by year. Accompanied by this, the printed circuit boards mounted on these electronic devices need to cope with high frequency and high speed, that is, they have low transmission loss in the high frequency band, and usually the substrate material has excellent dielectric properties (low dielectric constant and low dielectric loss tangent). In addition to the above-mentioned communication equipment, in the ITS field (related to auto...

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Problems solved by technology

[0005] One of the purposes of the present invention is to provide a thermosetting resin composition to improve the existing thermosetting resin prepared by using polyph

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