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Cantilever beam probe card prepared by MEMS process and preparation method

A cantilever beam probe and cantilever beam technology, applied in the field of probe cards, can solve problems such as difficulty in guaranteeing mechanical strength and toughness, and achieve the effects of convenient design, overall weight reduction, and weight improvement

Pending Publication Date: 2020-09-08
深圳市道格特科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing MEMS probe card generally uses a single-arm structure to support the probe tip, and it is difficult to guarantee the mechanical strength and toughness during testing.

Method used

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  • Cantilever beam probe card prepared by MEMS process and preparation method
  • Cantilever beam probe card prepared by MEMS process and preparation method
  • Cantilever beam probe card prepared by MEMS process and preparation method

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Embodiment Construction

[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0029] It should be noted that all directional indications (such as up, down, left, right, front, back, ...) in the embodiments of the present invention are limited to relative positions on the specified view, rather than absolute positions.

[0030] In addition, in the present invention, descriptions such as "first", "second" and so on are used for description purposes only, and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explici...

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Abstract

The invention relates to the technical field of probe cards and in particular relates to a cantilever beam probe card prepared by an MEMS process and a preparation method. An MEMS probe is arranged onthe bottom surface of the multilayer ceramic plate; the MEMS probe is electrically connected to the test circuit board, the test circuit board is electrically connected to the test machine, and the MEMS probe is in contact with a pin PAD position of the storage chip; the MEMS probe comprises a first cantilever beam and a second cantilever beam, and a hollow layer is formed between the second cantilever beam and the first cantilever beam. Compared with the prior art, the cantilever beam probe card prepared by the MEMS process and the preparation method have the advantages that the mechanical strength in the test process can be better met through the double-layer bearing structure of the first cantilever beam and the second cantilever beam, the hollow layer is favorable for improving the toughness, the service life of the MEMS probe can be effectively prolonged, and the cost is saved.

Description

【Technical field】 [0001] The invention relates to the technical field of probe cards, in particular to a cantilever beam probe card prepared by MEMS technology and a preparation method thereof. 【Background technique】 [0002] The probe card is a key component in the packaging and testing process of integrated circuit chips, and is used for testing of integrated circuit products before packaging. With the development of semiconductor manufacturing technology, the complexity of integrated circuit chips continues to increase, resulting in an increase in the number of chip pins and a continuous decrease in pin spacing. In order to improve the efficiency of testing, a probe card prepared by using MEMS technology has appeared. This type of probe card can greatly increase the number of probes, thereby improving the efficiency of one-time testing. The MEMS probe card in the prior art generally adopts a single-arm structure to support the probe tip, and it is difficult to guarantee ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/067
CPCG01R1/06727G01R1/06738G01R1/06744G01R31/2886
Inventor 刘志广孙锐锋
Owner 深圳市道格特科技有限公司
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