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Rolled copper foil for flexible printed substrate, flexible copper-clad laminate and flexible printed circuit substrate

A technology of flexible printing and calendering copper foil, applied in the directions of printed circuits, printed circuit manufacturing, printed circuit components, etc., can solve the problems of reduced bending, cube suppression, etc., to achieve the effect of excellent folding

Pending Publication Date: 2020-09-15
JX NIPPON MINING & METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the temperature is raised rapidly, multidirectionally oriented nuclei are generated and grown, and the development of cubic orientation is inhibited.
Therefore, compared with the casting method in which heating is performed relatively slowly during lamination, the lamination method tends to lower the flexibility (Patent Document 5)

Method used

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  • Rolled copper foil for flexible printed substrate, flexible copper-clad laminate and flexible printed circuit substrate
  • Rolled copper foil for flexible printed substrate, flexible copper-clad laminate and flexible printed circuit substrate
  • Rolled copper foil for flexible printed substrate, flexible copper-clad laminate and flexible printed circuit substrate

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Embodiment

[0065] Examples of the present invention will be shown below, but these are examples provided to further fully understand the present invention, and are not intended to limit the present invention.

[0066] [Manufacture of rolled copper foil]

[0067] The copper alloy with the composition described in Table 1 is used as a raw material to cast an ingot, and hot rolled at 800°C or higher until the thickness reaches 10mm. Rolling and finishing to a thickness of 0.009~0.018mm. The oxygen-free copper described in Table 1 is based on JIS-H0500 (C1011).

[0068] The calendering degree in the final cold rolling is set to 85~99.9% (1.9~6.6 in terms of true strain η), and the calendering degree (true strain η) in the final cold rolling of the embodiment is equal to the Ag concentration of the sample ( 280~360ppm) range such as image 3 As shown, adjust to the above (0.04 x C Ag -9.3)≤η≤(0.04C Ag -7.3).

[0069] For each rolled copper foil sample obtained in this way, I / I 0 and ev...

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Abstract

The subject of the invention is to provide a rolled copper foil for a flexible printed substrate, a flexible copper-clad laminate, and a flexible printed circuit substrate capable of stably obtainingbendability without depending on a heating condition at the time of manufacturing a flexible copper-clad laminate, and especially excellent in foldability. The olled copper foil for the flexible printed substrate comprsies 99.0 mass% or more of Cu, with the balance of unavoidable impurities. After air heating BY a heating pattern A which reaches 350 DEG C from 25 DEG C for more than 5 minutes andkeeps holding for 30 minutes at 350 DEG C, or a heating pattern B which reaches 350 DEG C from 25 DEG C in 1 second, the intensity (I) of a (200) plane obtained by X-ray diffraction of a rolled surface with respect to the intensity (I0) of the (200) plane obtained by X-ray diffraction of a fine powder copper is I / I0 >= 45.

Description

technical field [0001] The present invention relates to a rolled copper foil for a flexible printed substrate, a flexible copper clad laminate, and a flexible printed circuit substrate requiring flexibility. Background technique [0002] A flexible printed circuit board (FPC: Flexible Printed Circuit) has a circuit formed on a flexible copper clad laminate (FCCL: Flexible Cupper Clad Laminate). In addition, FCCL is formed by laminating resin on one or both sides of copper foil, but polyimide is often used for this resin. As FCCL, there are three-layer FCCL and two-layer FCCL from the point of view of its structure. [0003] A three-layer FCCL has a structure in which a resin film such as polyimide is bonded to copper foil as a conductive material with an adhesive such as epoxy resin or acrylic resin. On the other hand, a two-layer FCCL has a structure in which resin such as polyimide is directly bonded to copper foil as a conductive material. Two-layer FCCL is superior in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K1/09H05K1/02
CPCH05K3/022H05K1/09H05K1/028C22F1/08C22C9/00B32B15/08
Inventor 工藤雄大
Owner JX NIPPON MINING & METALS CO LTD
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