Tin bonding connection structure of crystal oscillator test base

Abstract

The invention discloses a tin bonding connection structure of a crystal oscillator test base, and belongs to the technical field of crystal oscillator test bases. The structure includes a test card, and test seat mounting holes is formed in the upper end surface of the test card; test seat contact pins are inserted into the test seat mounting holes; test card bonding pads are arranged on one sidesof the test seat contact pins; lap soldering tin is arranged between the test seat contact pins and the test card bonding pads; the test card bonding pads are fixedly connected to the upper end surface of the test card close to the test seat mounting holes; the test seat contact pins protrude out of the test seat mounting holes; the number of the test card bonding pads is the same as that of thetest seat mounting holes, and the test card bonding pads are in one-to-one correspondence with the test seat mounting holes, a second welding foot is arranged between one end of the lap soldering tinand the test card bonding pads, tin-free via hole structures are installed on the test seat contact pins, the test seat contact pins are adjacently connected with the test card pad structure to facilitate installation and fixing of the test seat contact pins, a connection point can be conveniently and nondestructively disassembled when the test seat contact pins are maintained and disassembled, and therefore the test seat contact pins can be rapidly replaced, the contact area is large, and heat dissipation is rapid.

Description

technical field [0001] The invention relates to the technical field of a crystal oscillator test stand, in particular to a tin connection structure of a crystal oscillator test stand. Background technique [0002] As the heart of electronic equipment, the importance of crystal oscillators in equipment is self-evident; with the development of technology, crystal oscillators are gradually chipped and miniaturized, which has higher requirements for the connection structure of test tools. The test seat is installed on the test board by directly welding the test seat pins into the test card installation hole. When the test seat needs to be repaired and replaced in this way, it is necessary to absorb the welded pads one by one, remove the solder, and then The test seat can only be removed, the operation is difficult, the pad is easily damaged, and the soldering tin is arranged in the test card installation hole, which also hinders the heat dissipation effect of the device during u...

AI Technical Summary

Problems solved by technology

[0002] As the heart of electronic equipment, the importance of crystal oscillators in equipment is self-evident; with the development of technology, crystal oscillators are gradually chipped and miniaturized, which has higher requirements for the connection structure of test tools. The test seat is installed on the test board by directly welding the test seat pins into the test card installation hole. When the test seat needs to be repaired and replaced in this way, it is necessary to absorb the welded pads one by one, remove the solder, and then The test seat can only be removed, the operation is difficult, the pad is easily damaged, and the soldering tin is arranged in the test card installation hole, which also hinders the heat dissipation effect of the device during use, and there are disadvantages in use. Based on this, the present invention designs a crystal oscillator test tool. The tin connection structure of the seat is used to solve the above problems

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