Signal transmission method, device and medium of high-speed differential signal line of circuit board

Abstract

The application discloses a signal transmission method, device and computer-readable storage medium of a high-speed differential signal line of a circuit board. Among them, the method includes calculating the dielectric constant of the glass fiber strip and the gel prepreg according to the equivalent dielectric constant of each type of plate, the proportion of glass fiber cloth and the proportion of resin, and is used to determine whether to cover the glass fiber strip Distinguish the dielectric constant of the first area and the second area; automatically generate the transmission rate information of each signal transmission line in the high-speed differential signal line according to the glass fiber cloth density of the current model plate, the dielectric constant of the first area and the second area , determining the wiring path of the high-speed differential signal line according to the transmission rate information, so as to perform high-speed signal transmission based on the wiring path. On the basis of not increasing the manufacturing cost of the circuit board, it can effectively solve the impact of glass fiber effect on high-speed differential signal transmission, and ensure that the signal received by the receiving end does not have distortion caused by different signals arriving at the same time.

Description

technical field [0001] The present application relates to the technical field of circuit board design of a server, in particular to a signal transmission method, device and computer-readable storage medium of a high-speed differential signal line of a circuit board. Background technique [0002] With the continuous development of the Internet industry, the signal transmission rate continues to increase, and the time of rising edge / falling edge is getting shorter and shorter, which is a severe challenge for the server R&D team. The research and development of the server is inseparable from the circuit board, such as figure 1 Shown is the structure of the circuit pack inside the server. The circuit board is generally composed of multiple layers of copper-clad core boards, and each layer of copper core boards is bonded with a glue-like prepreg. [0003] Such as figure 2 The structure of each copper clad core board is shown, including the first copper clad layer on the upper...

AI Technical Summary

Problems solved by technology

[0005] However, the plan of using flat cloth and two prepregs will undoubtedly increase the cost of the circuit board, and the offset angle of the wiring will greatly reduce the utilization rate of the board, which also increases the production cost of the circuit board

Although the related technology will improve the calculation accuracy of the transmission rate compared with the traditional technology, and try to make the dielectric constants felt by the two transmission lines of the differential signal the same, but because the final use is still the equivalent dielectric constant provided by the board factory, different areas The dielectric constant will still affect the signal transmission efficiency, causing the signal at the receiving end to be distorted, and will increase the manufacturing cost of the circuit board

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