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A finned microchannel design method for 3d-sip radio frequency microsystem

A design method and micro-system technology, applied in design optimization/simulation, computer-aided design, calculation, etc., can solve problems such as low design efficiency, shortening service life, hindering the improvement of chip liquid cooling device performance, etc., to reduce design costs , the effect of improving reliability and high design efficiency

Active Publication Date: 2022-04-05
XI AN JIAOTONG UNIV
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Problems solved by technology

The heating problem of the three-dimensional system package (3D-SIP) chip during use is inevitable, and the development trend of volume reduction and power increase leads to higher and higher heat flux density of the chip heating, while the heating of the 3D-SIP radio frequency microsystem Work will greatly increase the failure rate of the chip and shorten the service life, so higher requirements are put forward for the heat dissipation performance of the chip liquid cooling device
This design is inefficient, which hinders the improvement of the performance of the chip liquid cooling device and cannot meet the design requirements

Method used

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  • A finned microchannel design method for 3d-sip radio frequency microsystem
  • A finned microchannel design method for 3d-sip radio frequency microsystem
  • A finned microchannel design method for 3d-sip radio frequency microsystem

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Embodiment Construction

[0048] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0049] refer to figure 1 , a 3D-SIP radio frequency microsystem design method for finned microfluidic channels, comprising the following steps:

[0050] 1) Discretization of the design area: such as figure 2As shown, the design area, that is, the flow channel area of ​​the chip liquid cooling device is composed of upper and lower parts, which are divided into the upper flow channel and the lower flow channel according to the order in which the coolant flows. The actual size of the heat dissipation area to be designed is L (mm )×L(mm), according to the symmetric characteristics of the flow channel area of ​​the chip liquid cooling device, only a quarter of the flow channel area is designed, and the design result of the complete flow channel area is obtained through the symmetrical relationship; The actual parameters of the road area entity d...

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Abstract

A finned microchannel design method for 3D‑SIP radio frequency microsystems. Firstly, the design area is discretized, and the finite element model is initialized according to the actual working conditions and the permeability and thermal conductivity introduced by Darcy flow. Perform finite element analysis on the flow model and convection-diffusion equation, and then use the obtained physical field information to calculate the objective function, constraint function and the sensitivity of the constraint function to the design variables, and iterate continuously under the update of the MMA algorithm until it meets the requirements allowed in the design process. The maximum fluid volume ratio v 0 And the maximum inlet and outlet pressure difference ΔP allowed in the design process limit , or the number of iterations reaches the set maximum number of iterations loopmax, the present invention does not rely on design experience, and can use the Darcy flow model in the design stage to calculate the approximate physical field parameters of the design domain through the finite element method to obtain the chip liquid cooling device Performance parameters improve design reliability, have higher design efficiency, better design results, and reduce design costs.

Description

technical field [0001] The invention relates to the technical field of fin-type micro-channel design of a chip liquid cooling device, in particular to a method for designing a fin-type micro-channel of a 3D-SIP radio frequency microsystem. Background technique [0002] The life of the chip is one of the most important factors affecting the service life of electronic products. The heat dissipation of the chip liquid cooling device is an effective way for the chip to dissipate heat. The heating problem of the three-dimensional system package (3D-SIP) chip during use is inevitable, and the development trend of volume reduction and power increase leads to higher and higher heat flux density of the chip heating, while the heating of the 3D-SIP radio frequency microsystem Work will greatly increase the failure rate of the chip and shorten the service life, so higher requirements are put forward for the heat dissipation performance of the chip liquid cooling device. [0003] The f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/23G06F30/17G06F111/04G06F111/10G06F113/08G06F119/08
CPCG06F30/23G06F30/17G06F2119/08G06F2113/08G06F2111/10G06F2111/04
Inventor 李宝童谢晨寒刘宏磊尹鑫鑫洪军
Owner XI AN JIAOTONG UNIV
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