High-density refined heat-conducting copper foil layout method for high-frequency PCB

Abstract

A high-density refined heat-conducting copper foil layout method for a high-frequency PCB (printed circuit board) comprises the following steps: firstly, determining load and boundary conditions in adesign domain, including determination of a temperature boundary, a heat production area, an effective heat conductivity coefficient and a heat production rate; secondly, carrying out the topologicaloptimization of a rank-1 microstructure model, and carrying out the topological optimization of a heat conduction path of the high-frequency PCB by taking the optimal heat conduction microstructure rank-1 microstructure model as a material interpolation model; mapping the optimized structure of the high-frequency PCB; and finally, carrying out adaptive processing to obtain a final layout of the heat-conducting copper foil. Compared with a traditional topological optimization structure, the result obtained through the method is more excellent in thermal performance, and the method can be used for high-density refined heat conduction copper foil layout design of a high-frequency PCB.

Description

technical field [0001] The invention belongs to the technical field of structural thermal performance optimization design, and in particular relates to a layout method of high-density and refined heat-conducting copper foil of a high-frequency PCB circuit board. [0002] technical background [0003] The electronic unit in the high-frequency PCB circuit board is powered by the flow of current, and the current will cause heat dissipation and temperature rise in the surrounding space; higher operating temperature will reduce the performance of electronic components and seriously affect their reliability and safety. The failure rate is exponentially proportional to the operating temperature; likewise, high operating temperatures lead to high thermal stress at the joints of electronic components attached to circuit boards, leading to their failure; therefore, in the design and operation of electronic equipment, thermal control needs have become critical; [0004] The design of t...

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Problems solved by technology

[0003] The electronic unit in the high-frequency PCB circuit board is powered by the flow of current, and the current will cause heat dissipation and temperature rise in the surrounding space; higher operating temperature will reduce the performance of electronic components and seriously affect their reliability and safety. The failure rate is exponentially proportional to the operating temperature; likewise, high operating temperatures lead to high thermal stress at the joints of electronic components attached to circuit boards, leading to their failure; therefore, in the design and operation of electronic equipment, thermal control needs have become critical;

[0004] The design of the heat transfer structure layout has an important impact on its heat dissipation performance. The design of the structural layout form in engineering practice mostly depends on the experience and inspiration of the designer, and there is no effective design idea for a certain type of heat transfer structure. It must be applicable to other types of heat transfer structures. If the traditional topology optimization method can be used to improve the heat dissipation performance of the structure, it is also very limited, which cannot meet the current demand for thermal control inside the circuit board.

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