System and method for generating assembly process flow of multi-chip assembly

Abstract

The invention discloses a system and a method for generating an assembly process flow of a multi-chip assembly. The system comprises an information extraction module, a process information assignmentmodule, a process global mapping module, a process judgment module, a process sequencing module, a manual confirmation module, a step mapping module and an assembly process flow generation module. According to the invention, the multi-chip assembly assembling technological process is generated through computer assistance, the generating efficiency and accuracy of the technological process can be remarkably improved, and the requirement of technological process compilation for experience of technicians is lowered.

Description

technical field [0001] The invention belongs to the field of integrated circuit packaging, and in particular relates to a system and method for generating an assembly process flow of a multi-chip component. Background technique [0002] Multi-chip module (MCM, Multi-Chip Module) is to assemble bare chips, discrete components and other components on high-density interconnect substrates and interconnect and package them to realize high-density microelectronic components with certain functions. Typical assembly elements Including bare chips, discrete components, substrates, bonding wires, package shells, etc. Typical assembly processes include reflow soldering, die bonding, chip eutectic, chip flip chip, wire bonding, etc. With the increasing integration of multi-chip components, the difficulty of compiling the assembly process of multi-chip components is also increasing. The process compilation methods relying on manual means and process experience have problems of low efficie...

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Problems solved by technology

[0003] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides a multi-chip module assembly process flow generation system and method, which solves the problems of relying on manual labor, low efficiency and low accuracy for the preparation of multi-chip component assembly process flow

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