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Automatic Decrystallizing Machine and Decrystallizing Method

An automatic, wafer-based technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of low efficiency and achieve high efficiency

Active Publication Date: 2020-11-20
SHENZHEN XINYICHANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiment of the present application is to provide an automatic decrystallization machine and decrystallization method to solve the problem of low efficiency in the related art of manually removing the wafers on the substrate

Method used

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  • Automatic Decrystallizing Machine and Decrystallizing Method
  • Automatic Decrystallizing Machine and Decrystallizing Method
  • Automatic Decrystallizing Machine and Decrystallizing Method

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Embodiment Construction

[0049] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0050] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0051] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specify...

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Abstract

The invention provides an automatic wafer removing machine and a wafer removing method. The automatic wafer removing machine comprises: a rack; a rail mechanism for conveying a substrate; a wafer removing mechanism for removing and sucking wafers on the substrate; a gantry moving table for driving the crystal removing mechanism to move on the horizontal plane above the rail mechanism in two directions perpendicular to each other; and a recovery mechanism for recovering the wafers scraped off from the substrate, wherein the wafer removing mechanism comprises a scraping device used for removingthe wafers on the substrate and sucking the removed wafers to the recovery mechanism and a lifting mechanism for driving the scraping device to ascend and descend, and the lifting mechanism is installed on the gantry moving table. According to the automatic wafer removing machine, the substrate is conveyed through the rail mechanism, the scraping device moves to the position of the wafer needing to be moved through the gantry moving table and the lifting mechanism, and the scraping device is driven to scrape the wafer away from the substrate and suck the wafer to the recovery mechanism, so that automatic scraping and recovery of the wafer can be achieved, manpower is not needed, and efficiency is high.

Description

technical field [0001] This application belongs to the technical field of crystal bonding, and more specifically relates to an automatic crystal removal machine and a crystal removal method. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a light-emitting element that can convert electrical energy into light energy. With the maturity of LED technology, LED products are gradually used in lighting, display, signal indication and other fields. Users have higher requirements for the quality uniformity of LED products, especially the color temperature, brightness, and color rendering of LEDs are required to have good consistency. Then there are higher requirements for the precision of die bonding, and various errors in the LED die bonding process may lead to poor die bonding or die bonding failure. At this time, it is necessary to scrape out the failed wafer from the substrate and perform the die bonding again. In the past, the scraping work...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L33/00
CPCH01L21/67121H01L33/0095
Inventor 胡新荣
Owner SHENZHEN XINYICHANG TECH CO LTD