Insert part laser solder ball device and welding method

Abstract

The invention relates to an insert part laser solder ball device and a welding method. The insert part laser solder ball device comprises a feeding part, a laser welding part, a visual inspection part, a discharging part and a turntable part; the laser welding part comprises a nine-ball laser welding part and a ten-ball laser welding part; the feeding part, the nine-ball laser welding part, the visual inspection part, the ten-ball laser welding part, the visual inspection part and the discharging part are arranged evenly around the turntable part in the form of a hexagonal array in sequence; the turntable part comprises a turntable and a turntable base, and the turntable is arranged on the upper part of the turntable base in a rotatable manner; and the turntable part is provided with six tooling, and the tooling is a flat plate structure which can be flipped. The insert part laser solder ball device and the welding method have the advantages of welding multiple terminals at one time, less working procedure, convenient and quick, greatly improving efficiency and high automation, the welding of multiple terminals can be automatically completed at a time, and the automatic operation of automatic feeding, automatic welding and automatic discharging is realized; and the welding precision is high, the labor intensity is reduced, the production efficiency is high, the output is high,and the insert part laser solder ball device and the welding method are especially suitable for the production of a large number of terminals.

Description

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AI Technical Summary

Benefits of technology

This new technology allows for faster and more efficient weldings on many small parts without having to manually hold them together during each step or wait until they're ready again after being joined. Additionally it enables automatic load-bearing with materials that require minimal effort from operators while ensuring precise results.

Problems solved by technology

In traditional methods where multiple devices require different types of solder (pins) during assembly processes, there may have issues with each type being able to efficiently perform its function correctly without causing damage or improving their overall performance over time due to repeated use of these same components.

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