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Polyimide, polyimide solution composition, polyimide film, and substrate

A technology of polyimide film and polyimide, which is applied in the field of polyimide, can solve the problem of low solubility of polyimide precursor, low linear thermal expansion coefficient of polyimide, and inability to obtain polyimide and other problems, to achieve the effect of easy formation of fine circuits, extremely low linear thermal expansion coefficient, and high transparency

Pending Publication Date: 2020-10-13
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Regarding the imidization ratio, Patent Document 3 describes that a polyimide is produced by imidizing a polyimide precursor having an imidization ratio of 30% or more, Compared with the case of imidizing the polyimide precursor with an imidization rate of 0%, a polyimide with a low linear thermal expansion coefficient can be obtained; on the other hand, when the imidization rate exceeds 90%, The solubility of the polyimide precursor (or polyimide) decreases, the polyimide precursor (or polyimide) precipitates, and a polyimide with excellent characteristics cannot be obtained

Method used

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  • Polyimide, polyimide solution composition, polyimide film, and substrate
  • Polyimide, polyimide solution composition, polyimide film, and substrate
  • Polyimide, polyimide solution composition, polyimide film, and substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0130] 7.00 g (21.9 mmol) of TFMB and 6.23 g (17.9 mmol) of BAFL were added to the reaction vessel replaced with nitrogen, and the total mass of the monomers fed (the sum of the diamine component and the carboxylic acid component) was added to reach 23% by mass. A mixed solvent of 95.44 g of DMAc and GBL (DMAc:GBL=1:2 (weight ratio)) (31.81 g of DMAc and 63.63 g of GBL) was stirred at room temperature for 1 hour. To this solution, 15.28 g (39.7 mmol) of CpODA was slowly added. It stirred at 70 degreeC for 3 hours, and stirred at 160 degreeC for 7 hours, and obtained the uniform and viscous polyimide solution. The imidization rate of the obtained polyimide solution was 95% or more.

[0131] Coat the polyimide solution on the glass substrate, under nitrogen atmosphere (oxygen concentration below 200ppm), directly heat on the glass substrate from room temperature to 450°C, remove the solvent, and obtain a colorless and transparent polyimide film / Glass laminate. Next, the obta...

Embodiment 2

[0134]9.00 g (28.1 mmol) of TFMB and 6.53 g (18.7 mmol) of BAFL were added to the reaction vessel replaced with nitrogen, and the total mass of the monomers fed (the sum of the diamine component and the carboxylic acid component) was added to reach 23% by mass. An amount of 112.26 g of DMAc was stirred at room temperature for 1 hour. To this solution was slowly added CpODA 18.00 g (46.8 mmol). It stirred at 70 degreeC for 3 hours, and stirred at 160 degreeC for 7 hours, and obtained the uniform and viscous polyimide solution. The imidization rate of the obtained polyimide solution was 95% or more.

[0135] Coat the polyimide solution on the glass substrate, under nitrogen atmosphere (oxygen concentration below 200ppm), directly heat on the glass substrate from room temperature to 430°C, remove the solvent, and obtain a colorless and transparent polyimide film / Glass laminate. Next, the obtained polyimide film / glass laminate was immersed in water, peeled off, and dried to ob...

Embodiment 3

[0138] 9.00 g (28.1 mmol) of TFMB and 4.20 g (12.0 mmol) of BAFL were added to the reaction vessel replaced with nitrogen, and the total mass of the monomers fed (the sum of the diamine component and the carboxylic acid component) was added to reach 23% by mass. An amount of 95.85 g of DMAc was stirred at room temperature for 1 hour. To this solution was slowly added CpODA 15.43 g (40.2 mmol). It stirred at 70 degreeC for 3 hours, and stirred at 160 degreeC for 7 hours, and obtained the uniform and viscous polyimide solution. The imidization rate of the obtained polyimide solution was 95% or more.

[0139] Coat the polyimide solution on the glass substrate, under nitrogen atmosphere (oxygen concentration below 200ppm), heat directly on the glass substrate from room temperature to 410°C, remove the solvent, and obtain a colorless and transparent polyimide film / Glass laminate. Next, the obtained polyimide film / glass laminate was immersed in water, peeled off, and dried to ob...

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Abstract

Provided is a polyimide comprising more than 50 mol% of a repeating unit represented by chemical formula (1) with respect to total repeating units, the polyimide having, when measured as a 10 [mu]m-thick film, a thermal expansion coefficient of 25 ppm / K or less between 100 and 250 DEG C inclusive, and a transmittance of at least 80% at wavelength 400 nm.

Description

technical field [0001] The present invention relates to a polyimide having high transparency and an extremely low coefficient of linear thermal expansion, and a polyimide solution composition from which a polyimide having high transparency and an extremely low coefficient of linear thermal expansion can be obtained. In addition, the present invention also relates to a polyimide film and a substrate. Background technique [0002] In recent years, with the advent of an advanced information society, the development of optical materials such as optical fibers and optical waveguides in the optical communication field, liquid crystal alignment films, protective films for color filters, and other optical materials in the field of display devices has been promoted. In particular, in the field of display devices, research on lightweight and highly flexible plastic substrates is underway as a substitute for glass substrates, and development of bendable or rollable displays is being ac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10B32B17/10B32B27/34C08J5/18H05K1/03
CPCB32B17/10B32B27/34C08G73/10C08J5/18H05K1/03C08G73/1039C08G73/1078C08L79/08C08J2379/08
Inventor 冈卓也小滨幸德中川美晴久野信治
Owner UBE IND LTD
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