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Copper ball cleaning device

A technology of cleaning device and copper balls, applied in the direction of cells, electrolysis process, electrolysis components, etc., can solve the problems of difficult stirring by workers, difficult classification of copper balls, heavy copper balls, etc., and achieve the effect of reducing labor intensity

Pending Publication Date: 2020-10-16
陈文智
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional cleaning method is to pour the phosphor copper balls containing sludge into the cleaning pool filled with sulfuric acid and hydrogen peroxide. On the one hand, the copper balls are too heavy for workers to stir; Drain the liquid medicine, and then rinse it with tap water several times. As a result, the liquid medicine and sludge cannot be completely rinsed off, and it is difficult to classify large and small copper balls

Method used

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  • Copper ball cleaning device
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Embodiment Construction

[0034] The present invention will be described in detail below in conjunction with the accompanying drawings, and the technical solutions in the embodiments of the present invention will be clearly and completely described. Apparently, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be intervening components at the same time. When a component is said to be "set on" another component, it may be set directly on the other comp...

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Abstract

The invention discloses a copper ball cleaning device. The copper ball cleaning device comprises rotary screen provided with filter holes, wherein a conveying channel allowing copper balls to pass through is formed in the rotary screen, and a feeding cavity, a cleaning cavity and a screening cavity are sequentially formed in the conveying channel in the copper ball conveying direction; the cleaning cavity is formed in a cleaning area, and the copper balls entering the cleaning area are cleaned by a cleaning solution in the cleaning area; the screening cavity at least comprises a macroporous screening cavity which is away from the cleaning cavity and a microporous screening cavity which is close to the cleaning cavity, big ball discharge holes are formed in the macroporous screening cavity,and small ball discharge holes are formed in the microporous screening cavity; and a power device for driving the rotary screen to rotate is arranged on the rotary screen. The copper ball cleaning device aims at automatically cleaning the copper balls, and classifies the copper balls automatically after automatic cleaning is finished.

Description

technical field [0001] The present application relates to the field of printed circuit boards, in particular to a copper ball cleaning device. Background technique [0002] After the copper balls are used for a period of time in the electroplating of printed circuit boards, due to the high current density, the copper balls often produce anode mud too quickly, resulting in uneven plating on the board surface, and the board surface is not etched clean during the etching process, reducing product quality. Copper ball anode slime is produced too much, and when the deviation of upper and lower R values ​​exceeds 10um, take out the titanium basket with copper balls to observe the condition of copper ball anode slime. The anode sludge produced by the ball is cleaned, and the anode sludge produced on its surface can be cleaned before it can continue to be used. [0003] The traditional cleaning method is to pour the phosphor copper balls containing sludge into the cleaning pool fil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23G3/00C25D21/14C25D21/08
CPCC23G3/00C25D21/14C25D21/08
Inventor 陈文智
Owner 陈文智