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Upper race lubricating method for rapid thermal processing (RTP) machine station

A ball and top ring technology, used in mechanical equipment, electrical components, bearing components, etc., can solve the problems of scratches on the back of the product, unsatisfactory lubrication effect, uneven rotation of the edgering, etc., to improve the lubrication state and reduce scratches. Risk, the effect of smooth and even rotation

Inactive Publication Date: 2020-10-16
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In actual operation, since the gap for applying lubricant to the bottom ring of the ball is narrow, it is not easy to apply it evenly, and the contact surface with the ball of the supported ball bearing is small, so the lubrication effect is not ideal, which makes the edge ring rotate unevenly, and finally Cause scratches on the back of the product

Method used

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  • Upper race lubricating method for rapid thermal processing (RTP) machine station
  • Upper race lubricating method for rapid thermal processing (RTP) machine station
  • Upper race lubricating method for rapid thermal processing (RTP) machine station

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Embodiment Construction

[0017] In the method for lubricating the upper top ring of the RTP machine ball according to the present invention, the wafer support platform of the machine is supported by a supporting structure composed of the upper top ring of the ball, the ball bearing, the spacer, and the lower bottom ring of the ball; figure 1 and figure 2 as shown, figure 1 The middle part is the wafer support, which is a structural part directly in contact with the wafer. The wafer is placed on the wafer support, and the wafer support drives the wafer to rotate. figure 2 The supporting structure shown is located at figure 1 Below the wafer pedestal shown, the wafer pedestal is supported. The ball bearing and the spacer are located between the upper top ring of the ball and the lower bottom ring of the ball. The ball bearing is composed of multiple balls and spacers. The balls can roll freely and flexibly to reduce the coefficient of friction. Multiple spacers are located between the balls to ensur...

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PUM

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Abstract

The invention discloses an upper race lubricating method for a rapid thermal processing (RTP) machine station. The upper race lubricating method for the RTP machine station is characterized in that awafer edge ring of the machine station is supported by a support structure consisting of an upper race, a ball bearing, spacers and a lower race; the ball bearing and the spacers are positioned between the upper race and the lower race; and a lubricating agent is evenly smeared in a groove of the upper race of the wafer edge ring support structure. According to the method, the lubricating agent isevenly smeared in the groove, which is contact with balls of the ball bearing, of the upper race, so that contacts between the upper race and the balls can be fully lubricated by the lubricating agent with the larger contact area; the lubricating state between the upper race and the balls is improved; the wafer edge ring rotates more smoothly and evenly under the support of the upper race; and the risk of scratching of the back side of a wafer due to uneven rotation of the wafer edge ring is lowered.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit manufacturing, in particular to a method for lubricating a top ring on a ball of an RTP machine used in an RTP process. Background technique [0002] In the process of wafer manufacturing, high-temperature processes are often used, such as film deposition, or high-temperature thermal annealing after ion implantation, etc. There is a problem of redistribution of impurities after ion implantation at high temperature. For small-scale devices, this redistribution is often very undesirable, so in recent years emphasis has been placed on low-temperature processes that minimize diffusion. However, some processes, such as post-implantation annealing, are not as effective at low temperatures as at high temperatures, and if high temperatures are not reached, certain types of implant damage cannot be removed by annealing. In addition, the annealing temperature required to fully activate cert...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16C33/66H01L21/67
CPCF16C33/6651H01L21/67115
Inventor 潘春蒙
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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