Method for inspecting mounting state of component, printed circuit board inspection apparatus, and computer readable recording medium
A technology of printed circuit boards and inspection devices, which is applied in the direction of calculation, calculation models, measurement devices, etc., can solve problems such as quality reduction, noise, and inability to accurately perform placement status inspections, and achieve the effect of reducing noise
Active Publication Date: 2020-10-16
株式会社高迎科技
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Problems solved by technology
[0004] On the other hand, in the process of generating the image related to the printed circuit board by the AOI device, multiple reflections of the light irradiated on the printed circuit board may occur, or noise may occur in the process of processing the received light by the image sensor, etc.
That is, optical noise and signal noise are generated in various ways, and if the noise generated in this way is not reduced, the quality of the captured image of the printed circuit board generated by the AOI device will be degraded
If the quality of the captured image of the printed circuit board deteriorates, the inspection of the mounting status of the components mounted on the printed circuit board using the captured image of the printed circuit board cannot be performed accurately
Method used
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[0035] The embodiments of the present disclosure are examples for the purpose of explaining the technical idea of the present disclosure. The scope of rights of the present disclosure is not limited to the following examples or specific descriptions of these examples.
[0036] Unless otherwise defined, all technical terms and scientific terms used in the present disclosure have the meanings commonly understood by those of ordinary skill in the art to which the present disclosure belongs. All terms used in the present disclosure are selected for the purpose of more clearly describing the present disclosure, and are not selected for limiting the scope of rights of the present disclosure.
[0037] Expressions such as "comprising", "having", and "having" used in the present disclosure, as long as no different meanings are mentioned in the sentences or articles containing the corresponding expressions, should be understood as having the possibility of including other embodiments....
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A printed circuit board inspection apparatus can inspect a mounting state of a component by generating depth information on the component by using a pattern of light reflected from the component mounted on a printed circuit board received by an image sensor, generating two-dimensional image data for the component by using at least one of light of a first wavelength, light of a second wavelength, light of a third wavelength, and light of a fourth wavelength reflected from the component received by a first image sensor, inputting the depth information and the two-dimensional image data for the component into a machine learning-based model, obtaining noise-reduced depth information from the machine learning-based model, and using the noise-reduced information.
Description
technical field [0001] The present disclosure relates to a method for inspecting a mounting state of components, a printed circuit board inspection device, and a computer-readable recording medium. Background technique [0002] Generally speaking, in the manufacturing process using surface mount technology (SMT: Surface Mounter Technology) on printed circuit boards, the screen printer prints solder paste on the printed circuit board, and the placement machine mounts the components on the printed circuit board. A printed circuit board. [0003] Also, automated optical inspection (AOI: automated optical inspection) is used to inspect the mounting state of components mounted on the printed circuit board. The AOI device uses the captured image of the printed circuit board to check whether the components are mounted normally on the printed circuit board without position separation, warping, tilting, etc. [0004] On the other hand, when an AOI device generates an image related ...
Claims
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IPC IPC(8): G01N21/956G01N21/88G06N20/00
CPCH05K13/08G06N3/08H05K13/0815H05K13/0817G01B11/2509G06T7/521G06T2207/10028G06T2207/30141G06T2207/10024G06T2207/20084G06T7/586G01N21/95684G01N2021/95638G01N21/8851G06N3/047G06N3/045G06T5/70G06T5/60H05K13/081G01B11/22G01N21/956G06T7/0004G06T2207/20081G01B11/24G06T2207/10152H04N23/56H04N23/90
Inventor 李洗璘姜镇万郑仲基孙廷呼尹珉哲
Owner 株式会社高迎科技