Production method for manufacturing 12-inch wafer by using 8-inch wafer production line

Abstract

The invention provides a production method for manufacturing a 12-inch wafer by using an 8-inch wafer production line, and the method comprises the following steps: S1, taking a wafer, obtaining a 12-inch wafer, and enabling the thickness of the 12-inch wafer to be 700 [mu] m; S2, numbering: dividing the 12-inch wafer into four parts with the same size, and numbering each part; S3, slicing, cutting each numbered part to equally divide the 12-inch wafer into four parts of sub-wafers; S4, trimming, trimming the two corners, far away from the circle center, of the sub-wafer; S5, performing thinning, and thinning the trimmed sub-wafers; S6, performing scribing, wherein scribing is carried out on the thinned sub-wafers; S7, wafer mounting, mounting the scribed sub-wafers, and packaging each sub-wafer into a 12-inch wafer according to the serial number; and in S4-S7, processing by adopting an 8-inch wafer production line. According to the production method, the purpose of manufacturing the 12-inch wafer on the 8-inch wafer production line can be achieved, so that the economic pressure of a small factory is effectively relieved, and the development of semiconductors and economy is promoted.

Description

technical field [0001] The application belongs to the technical field of wafer production, and more specifically relates to a production method for manufacturing 12-inch wafers with an 8-inch wafer production line. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and become an IC with specific electrical functions. product. [0003] At present, the chip manufacturing process can be summarized as wafer processing process, wafer packaging and testing process, wafer construction process and testing process. Among them, wafer processing process and wafer packaging and testing process are referred to as wafer front-end process, and The assembly process and testing process are referred to as wafer back-end processes for short. Among them, the wafer front-end proce...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the embodiment of the present application is to provide a production method for manufacturing 12-inch wafers with an 8-inch wafer production line to solve the technical problem that 8-inch wafer equipment cannot produce 12-inch wafers in the prior art

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