Chip-level LED integrated fluorescent lamp core

Abstract

The invention discloses a chip-level LED integrated fluorescent lamp core, which is characterized in that LED blue light excitation chips or purple light excitation chips are uniformly distributed ona bracket with a printed electronic circuit to form an LED original light body, the original light body is packaged in a fluorescent glass tube, and inert gas is filled into the fluorescent glass tubeafter the original light body is treated by a vacuum exhaust process. The LED original light body emits blue light or purple light to excite the fluorescent glass tubes with different color temperatures to emit light with different color temperatures. The chip-level LED integrated fluorescent lamp core can be combined together independently or in series and in parallel, can be packaged in a bulbshell to form an LED bulb, is embedded in a solid light-transmitting material to form a special-shaped LED light source, and is packaged in a glass tube to form an LED lamp tube. Due to the fact thatthe fluorescent glass tube is filled with the inert gas, the LED chip and the fluorescent body are protected, heat dissipation of the LED chip is facilitated, the lighting effect of the LED light source is improved, and the service life of the LED light source is prolonged.

Description

technical field [0001] The invention relates to a chip-level LED integrated fluorescent wick, specifically, the chip-level LED is integrated and packaged in a fluorescent glass tube; and after vacuum exhaust treatment, an inert gas is filled to form an independent light source, and the light source can be single or multiple in series and parallel. Composed of a variety of power, and can be packaged in bulbs, glass tubes, special-shaped light-transmitting materials. Background technique [0002] At present, the LED chip packaging used as a light source is to mix epoxy resin, silica gel and phosphor powder to form a fluorescent colloid as the packaged luminescent material, which directly acts on the surface of the LED chip. This direct packaging method is not conducive to the heat dissipation of the LED chip. Due to the work of the LED chip When the temperature is high, the aging of the fluorescent colloid will be accelerated or even fall off, which will affect the luminous ef...

AI Technical Summary

Problems solved by technology

[0002] At present, the LED chip packaging used as a light source is to mix epoxy resin, silica gel and phosphor powder to form a fluorescent colloid as the packaged luminescent material, which directly acts on the surface of the LED chip. This direct packaging method is not conducive to the heat dissipation of the LED chip. Due to the work of the LED chip When the temperature is high, it will accelerate the aging or even fall off of the fluorescent colloid, which will affect the luminous efficiency of the LED lamp, cause the LED light to decay, and reduce the service life of the LED lamp.

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