Stacked chip, manufacturing method, image sensor and electronic device
A manufacturing method and stacking technology, applied in the field of manufacturing methods, image sensors and electronic equipment, and stacked chips, can solve the problems of increasing the manufacturing cost of stacked chips and wasting wafer area
Pending Publication Date: 2020-10-23
SHENZHEN GOODIX TECH CO LTD
View PDF8 Cites 7 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In order to meet the stacking process requirements, the upper wafer and the lower wafer have the same wafer size, and the number of upper wafers on the upper wafer is equal to the number of wafers on the lower wafer, but when the upper wafer and the lower wafer are not the same type of wafer, This stacking method will cause waste of wafer area and increase the manufacturing cost of stacked chips
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0079] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.
[0080] It should be understood that the specific examples herein are only intended to help those skilled in the art better understand the embodiments of the present application, rather than limit the scope of the embodiments of the present application.
[0081] It should also be understood that in various embodiments of the present application, the sequence numbers of the processes do not mean the order of execution, and the execution order of the processes should be determined by their functions and internal logic, and should not be used in the embodiments of the present application. The implementation process constitutes any limitation.
[0082] It should also be understood that the various implementation manners described in this specification can be implemented alone or in combination, which is not limited in the embodiments of...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
A stacked chip, a manufacturing method, an image sensor and an electronic device can reduce the manufacturing cost of the stacked chip. The stacked chip includes: a carrier unit in which a first accommodating structure is provided, and the first accommodating structure is a groove or a through hole; a first wafer, which is provided in the first accommodating structure; and a redistribution layer,which is disposed above the first chip; a first pad, which is disposed above the redistribution layer, and is electrically connected to the first chip through the redistribution layer; a second wafer,which is stacked above the carrier unit and the first chip, and includes a second pad electrically connected to the first pad, wherein the surface area of the second wafer is larger than the surfacearea of the first wafer.
Description
technical field [0001] The present application relates to the field of semiconductor chips, and more specifically, to a stacked chip, a manufacturing method, an image sensor and an electronic device. Background technique [0002] With the development of semiconductor and integrated circuit technology, the device types of chips are becoming more and more abundant, and the integration level is getting higher and higher. On the two-dimensional plane, with the development of semiconductor technology to a certain extreme level, it is impossible to further improve the performance of the chip. Therefore, a concept of three-dimensional stacking is currently proposed in the industry, which expands the chip from two-dimensional to three-dimensional, that is, chip modules with different functions are stacked up and down together for packaging, so as to improve the overall performance and yield of the chip. [0003] In one implementation, the upper wafer (Die) and the lower wafer are st...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L21/98H01L27/146
CPCH01L25/167H01L25/50H01L27/14632H01L27/14634H01L27/14643H01L27/14687H01L27/14689H01L2224/18
Inventor 陆斌姚国峰沈健
Owner SHENZHEN GOODIX TECH CO LTD