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Mixed wettability micro-nano composite enhanced heat exchange structure and preparation method thereof

A micro-nano composite and enhanced heat transfer technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of limited heat transfer performance of high heat flux pool boiling and no consideration of hydrophilic and hydrophobic wetting properties

Active Publication Date: 2020-10-27
XIAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, most of the existing studies on enhancing heat transfer by adjusting surface wettability are based on two-dimensional smooth surfaces, and only focus on the influence of hydrophilic and hydrophobic wettability on heat transfer, while ignoring the influence of surface micro-nano structure; similarly, In the research on heat transfer enhancement of micro-nano composite structure, the main focus is on the influence of surface micro-nano structure on heat transfer, and the important factor of hydrophilic and hydrophobic wettability is not considered, which makes it very difficult to improve the pool boiling heat transfer performance of high heat flux. limited

Method used

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  • Mixed wettability micro-nano composite enhanced heat exchange structure and preparation method thereof
  • Mixed wettability micro-nano composite enhanced heat exchange structure and preparation method thereof
  • Mixed wettability micro-nano composite enhanced heat exchange structure and preparation method thereof

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Embodiment Construction

[0036] Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein; A more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are for exemplary purposes only, and are not intended to limit the protection scope of the present invention.

[0037] It should be noted that concepts such as "first" and "second" mentioned in the present invention are only used to distinguish different devices, modules or units, and are not used to limit the sequence of functions performed by these devices, modules or units or interdependence.

[0038] It should be noted that the modifications of "one" and "multiple" mentioned ...

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Abstract

The invention discloses a mixed wettability micro-nano composite enhanced heat exchange structure. The structure comprises a heat dissipation substrate, wherein a plurality of square micro-cylindricalarray units and groove channels arranged among the micro-cylindrical array units are etched on the heat dissipation substrate. Each micro-cylinder array unit comprises a plurality of micro-cylinderswhich are arranged in order, nanowires are arranged on the groove channels and the micro-cylinders, the diameter of the nanowires ranges from 200 nm to 500 nm, and the height of the nanowires ranges from 10 micrometers. The invention further discloses a manufacturing method of the mixed wettability micro-nano composite enhanced heat exchange structure. The micro-cylindrical array unit and the nanowire structure adopted by the invention can effectively enhance the boiling heat transfer coefficient of high heat flux and delay the boiling dry burning phenomenon.

Description

technical field [0001] The invention belongs to the technical field of thermal control of electronic devices, and in particular relates to a mixed wettability micro-nano composite enhanced heat exchange structure and a preparation method of the structure. Background technique [0002] With the rapid development of micro-electro-mechanical technology, the miniaturization and integration of electronic devices has become an inevitable trend, the heat generation per unit volume is increasing, and the heat dissipation of high-power devices in small spaces has become an urgent problem to be solved. [0003] Boiling heat transfer, as a phase-change heat transfer method, has an order of magnitude difference in heat transfer coefficient compared with traditional air cooling and liquid single convection, and is a very effective heat dissipation method. However, when the heat flux is high, the boiling heat transfer performance is often severely deteriorated. The fundamental reason is t...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/46
CPCH01L23/367H01L23/46
Inventor 王雪丽张欢姬长发
Owner XIAN UNIV OF SCI & TECH
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