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Processing device, semiconductor device production method and program

A technology for processing devices and programs, applied in semiconductor/solid-state device manufacturing, chemical instruments and methods, combustion methods, etc.

Pending Publication Date: 2020-10-27
KOKUSA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, if the by-products adhere to and accumulate in the detoxification device, the device may be stopped even in the middle of production.
Therefore, the product substrate has to be unloaded, and the production process has to be interrupted to maintain the detoxification device

Method used

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  • Processing device, semiconductor device production method and program
  • Processing device, semiconductor device production method and program
  • Processing device, semiconductor device production method and program

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Experimental program
Comparison scheme
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Embodiment Construction

[0018]

[0019] One embodiment of the present invention will be described below.

[0020] (1) Configuration of substrate processing equipment

[0021] while referring to figure 1 , while describing the configuration of the processing furnace 202 of the substrate processing apparatus 100 which is a processing apparatus according to an embodiment of the present invention.

[0022] Such as figure 1 As shown, the processing furnace 202 has a process tube 203 as a reaction tube. The process pipe 203 has an inner tube 204 as an inner reaction tube, and an outer tube 205 as an outer reaction tube provided outside it. The inner tube 204 is formed in a cylindrical shape with open upper and lower ends. A processing chamber 201 for processing a wafer 200 is formed in the hollow portion of the cylinder inside the inner tube 204 . The processing chamber 201 is configured to accommodate a boat 217 .

[0023] On the outside of the process pipe 203 , a heater 206 is provided so as to ...

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PUM

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Abstract

The invention eliminates, at an appropriate timing, a by-product adhered to a detoxification device allowing the operation rate of the device to be improved. The invention comprises at least: a processing chamber constituted inside a processing oven; an exhaust system connected to a plurality of detoxification devices, for exhausting a gas from the processing chamber; and a control unit executinga process recipe whereby a film is formed on a substrate that has been introduced into the processing chamber. The control unit is constituted in such a manner as to verify, at the process recipe starting or ending time, the operating state of a detoxification device other than a running detoxification device. The control unit performs a control wherein: if the other detoxification device is in anoperating state of being under maintenance, the other detoxification device is run, and the running detoxification device is switched to the operating state of being under maintenance; and if the other detoxification device is in the operating state of being under maintenance, the running detoxification device is continued to be used as is.

Description

technical field [0001] The present invention relates to a processing device, a method for manufacturing a semiconductor device, and a program. Background technique [0002] In the processing process of semiconductor devices, harmful gases are sometimes contained in the discharged gas, and thus by using a detoxification device, the detoxification process is performed on the detoxified gas to make it harmless and discharge it into the atmosphere (for example, refer to Patent Document 1 ). [0003] However, if the by-products adhere to and accumulate in the detoxification device, the device may be stopped even in the middle of production. Therefore, the product substrate has to be unloaded, and the production process has to be interrupted to maintain the detoxification device. [0004] prior art literature [0005] patent documents [0006] Patent Document 1: Japanese Patent Application Laid-Open No. 11-197440 Contents of the invention [0007] An object of the present i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02B01D53/38B01D53/76C23C16/52F23G7/06H01L21/31H01L21/318
CPCB01D53/38B01D53/76C23C16/52F23G7/06H01L21/02H01L21/31H01L21/0217H01L21/0228H01L21/02211C23C16/4412F23G2209/142C23C16/45544C23C16/345H01L21/02271H01L21/67017H01L21/67109H01L21/67303
Inventor 奥野正则米岛利彦
Owner KOKUSA ELECTRIC CO LTD