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Back protection device for alloy laser forming connection and manufacturing process method thereof

A technology of laser forming and back protection, which is applied in the field of material processing, and can solve the problems of affecting the stability of laser forming, increasing the overall structure, and increasing costs.

Pending Publication Date: 2020-10-30
齐齐哈尔金车工业有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The invention provides a back protection device and a manufacturing process method for alloy laser forming connection to overcome the increase in the overall structure caused by the use of temporary or permanent backing plates and back protection gas in the prior art, resulting in increased costs. And affect the stability of laser forming, etc.

Method used

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  • Back protection device for alloy laser forming connection and manufacturing process method thereof
  • Back protection device for alloy laser forming connection and manufacturing process method thereof

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Embodiment Construction

[0027] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0028] like figure 1 and 2 As shown, the present invention provides a kind of back protection device for alloy laser forming connection, comprising:

[0029] Body 1, the upper surface of the body 1 is provided with a first groove 2 along the length direction of the body, the bottom of the first groove 2 is connected to the second groove 3, and the groove width of the first groove 2 is The distance is less than the groove width distance of the second groove, and the groove depth of the first groove 2 is greater than the groove depth of the second groove 3;

[0030] The area corresponding to the first groove 2 in the second groove 3 communicates with the first groove 2;

[0031] Two shaped connecting plates that are side by side and close together are placed on the body 1, and the two shaped connecting plates 4 cover the first groove 2;

[0032] The...

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Abstract

The invention relates to the technical field of material processing, and particularly relates to a back protection device for alloy laser forming connection and a manufacturing process method thereof.The protection device comprises a body; a first groove is formed in the upper surface of the body in the length direction of the body, a second groove is connected to the bottom of the first groove,the groove width distance of the first groove is smaller than the groove width distance of the second groove, and the groove depth of the first groove is larger than the groove depth of the second groove; the area, corresponding to the first groove, in the second groove is in communication with the first groove; two flat plates in a seamless butt joint form are placed on the body, and the two flatplates cover the first groove; and a laser layer is arranged in the second groove and is made of a laser high-reflection material. The back protection device for the alloy laser forming connection issimple in structure and low in cost, and the added laser layer improves the smooth stability and the escape efficiency of gas in a melting channel to the maximum extent in the forming connection process.

Description

technical field [0001] The invention relates to the technical field of material processing, in particular to a back protection device for alloy laser forming connection and a manufacturing process method. Background technique [0002] As we all know, aluminum alloy has low density, but relatively high strength, good plasticity, can be processed into various profiles, has excellent electrical conductivity, thermal conductivity and corrosion resistance, etc. has been widely applied. [0003] In the past production practice, GMAW and GTAW were commonly used for the forming connection of aluminum alloys. Although these two forming connection methods have high energy density and can obtain good joints when forming and connecting aluminum alloys, they still have poor penetration ability and deformation of the forming connection. Large, low production efficiency and other shortcomings. With the development of science and technology, the laser forming connection of aluminum alloys...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/70B23K26/26B23K103/10B23K103/12
CPCB23K26/702B23K26/26B23K2103/10B23K2103/12
Inventor 郭文革
Owner 齐齐哈尔金车工业有限责任公司
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