Metal layer, paper pot and manufacturing method of paper pot
A manufacturing method and metal layer technology, applied in the fields of application, cooking utensil structure, kitchen utensils, etc., can solve the problems of insufficient ductility, flexibility and strength of the metal layer, poor formability of the metal layer, poor thermal conductivity of the metal layer, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0035] A metal layer provided by an embodiment of the present invention includes Al: 80%-89%, Fe: 0.4%-0.7%, in terms of mass percentage. The metal layer, the resin layer, and the paper layer together form a composite layer, which is used to make a paper pot. The paper pot is used for matching with an induction cooker, or the paper pot is used to generate electromagnetic waves for magnetic field induction current (also known as eddy current). The heating principle is used in conjunction with the heating equipment. Since the metal layer, the resin layer, and the paper layer constitute the composite layer, when the paper pot is formed by stamping, in order to suppress the generation of flange wrinkles, a high wrinkle pressure is usually applied. When high crease pressure is loaded, the stamping load becomes large due to the high friction between the two sides of the mold and the paper pot material. Therefore, in order to carry out deeper forming during stamping and forming of t...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com