Bearing device and process chamber

Abstract

The invention provides a bearing device and a process chamber. The bearing device comprises a rotatable bearing disc, at least three ejector pins and a lifting mechanism, wherein the bearing disc is provided with a plurality of stations which are arranged at intervals in the circumferential direction of the bearing disc and are used for bearing wafers; besides, at least three through holes penetrating through the bearing disc in the thickness direction of the bearing disc are formed in each station of the bearing disc, and the at least three through holes are distributed in the circumferentialdirection of the station where the through holes are located at intervals; the at least three ejector pins are vertically arranged below the bearing disc and located at the positions corresponding towafer taking and placing positions, and the positions of the ejector pins correspond to the positions of the through holes in the stations rotated to the wafer taking and placing positions in a one-to-one mode; and the lifting mechanism is used for driving each ejector pin to pass through each through hole corresponding to the ejector pin to ascend or descend to a position higher than or lower than the station. According to the invention, the safety and compatibility of the wafer on the bearing device are improved, and the process uniformity of the wafer is also improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a carrying device and a process chamber. Background technique [0002] At present, the pick-and-place process in the process of semiconductor equipment includes: single pick-and-place and multi-station flow pick-and-place modes. [0003] For the multi-station flow pick-and-place mode, the currently more commonly used process is: the manipulator transfers the wafers in the loading chamber to the reaction chamber, and the reaction chamber is equipped with multiple shower heads and an integral heater. Contains a film transfer mechanism, the function of the film transfer mechanism is to pass the manipulator into the wafer to catch it, place it on the heater, and transfer the wafer to the next shower head after a single glow, the pick-and-place structure is as follows figure 1 and figure 2 As shown, the heater 1' carrying the wafer is provided with a fork finger groove 11...

AI Technical Summary

Problems solved by technology

[0004] The pick-and-place structure of the prior art has the following disadvantages: 1) the fork fingers are located below the wafer, and their positions pass through most of the wafer area. Different from other positions of the heater; 2) The upper surface of the fork finger is lower than the upper surface of the heater, so a gap will be formed between the upper surface of the fork finger and the corresponding lower surface of the wafer, and gas will enter the gap after the process is performed, further causing the wafer temperature Inhomogeneous, and the incoming gas will be deposited on the back of the wafer to form a thin film; 3) Although the upper surface of the fork finger passes through most of the wafer, the center of gravity of the wafer is on the fork finger. When the fork finger lifts the wafer, the fork finger cannot effectively fix the wafer , when the finger assembly rotates in the circumferential direction, the wafer may slip off from the finger; 4) the finger structure is poorly compatible in terms of wafer size

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