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IPM power module with compact structure

A power module, compact technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as loss, scrapping of the entire module, waste, etc.

Pending Publication Date: 2020-10-30
YANGZHOU GUOYANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] At present, the IPM modules on the market can only be tested for relevant electrical performance after the module packaging is completed. If the failure is found, it will directly lead to the scrapping of the entire module, causing unnecessary losses and waste.

Method used

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  • IPM power module with compact structure
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  • IPM power module with compact structure

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Embodiment Construction

[0034] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0035] Such as image 3 As shown, the compact IPM power module of the present invention includes a bottom plate 1 and an insulating substrate 2 arranged on the bottom plate, and the insulating substrate is welded to the bottom plate 1 by solder. The chip 3 and the needle electrode 4 are welded to the insulating substrate by solder, and at the same time, the chip and the insulating substrate are bonded and connected by the aluminum wire 5 to form a power loop. The control circuit board 6 is arranged above the insulating substrate, that is, the insulating substrate is located at the lower layer of the module, and the control circuit board is located at the upper layer of the module, so as to optimize the internal structure of the module. A control circuit is provided on the control circuit board, and the control circuit board P...

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PUM

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Abstract

The invention discloses a compact-structure IPM power module, and the module comprises an insulating substrate disposed on a bottom plate, and the insulating substrate is provided with a power circuit. The module further comprises a control circuit board positioned above the insulating substrate and a shell fixed on the bottom plate, terminals are arranged on the periphery of the shell, the tail parts of the terminals are inserted into connecting holes correspondingly formed in the periphery of the control circuit board, and the control circuit board are fixed and electrically connected; meanwhile, the head parts of the terminals extend out of the shell to be electrically connected with an external circuit; and the control circuit board is electrically connected with the insulating substrate through needle-shaped electrodes. According to the IPM power module with the compact structure, the PCB with an integrated control and evaluation logic unit is added, and the PCB is supported and fixed only by the terminals, so that the shell structure is simplified, and the process difficulty is reduced. The single insulating substrate forms an electrical loop, electrical performance testing can be carried out, defective chips are screened out in advance and replaced, the failure and scrapping of the whole module are avoided, and the cost is reduced.

Description

technical field [0001] The invention relates to the field of power electronic power modules, in particular to a compact IPM power module. Background technique [0002] Power electronics technology occupies a very important position in today's fast-growing industrial field. As a representative of power electronics technology, power electronics power modules have been widely used in electric vehicles, photovoltaic power generation, wind power generation, industrial frequency conversion and other industries. With the rise of my country's industry, power electronics power modules have a broader market prospect. [0003] At present, power electronic power modules are gradually developing in the direction of integration and intelligence, and IPM modules emerge as the times require. Compared with the standard power module, the IPM module adds an additional control and evaluation logic unit, which is integrated on the PCB inside the power module. [0004] The IPM power modules lau...

Claims

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Application Information

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IPC IPC(8): H01L23/495
CPCH01L23/4952H01L2224/49111H01L2224/48139H01L2224/0603H01L2924/19107
Inventor 杨阳牛利刚金晓行王玉林
Owner YANGZHOU GUOYANG ELECTRONICS CO LTD
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