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DFN or QFN lead frame and manufacturing method thereof

A lead frame and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of easy deformation, general pin strength, and low utilization rate of lead frame materials

Pending Publication Date: 2020-10-30
GUANGDONG CHIPPACKING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The utilization rate of this kind of lead frame material is low, the pin strength is average, and it is easy to deform when the wire is bonded for many times, so it needs to be improved

Method used

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  • DFN or QFN lead frame and manufacturing method thereof
  • DFN or QFN lead frame and manufacturing method thereof
  • DFN or QFN lead frame and manufacturing method thereof

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0024] As embodiment one of the DFN or QFN lead frame of the present invention, as Figure 1 to Figure 6 As shown, it includes a base island 1, pins 2 and molding compound 3, and the molding compound 3 connects the base island 1 and pins 2 to form an overall frame.

[0025] The manufacturing method of DFN or QFN lead frame described in the present invention, comprises the following steps:

[0026] S1: arrange the strip-shaped base island and pins in the injection mold according to the position requirements;

[0027] S2: inject molding compound in the injection mold, and the plastic sealing compou...

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Abstract

The invention relates to a DFN or QFN lead frame and a manufacturing method thereof, the lead frame comprises a base island, pins and a molding compound, and the molding compound connects the base island and the pins into an integral frame. By adopting a novel structure, the lead frame completely breaks away from a copper sheet stamping process idea, the base islands and the pins are connected into the integral frame by using a plastic package material, the positions and the fixing firmness of the base islands and the pins are ensured by using the plastic package material, and as connecting ribs and peripheral frames in the traditional lead frame are not required to be arranged, the material utilization rate of copper materials is very high, and a front film pasting or rear film pasting process is not required; the strength of the lead frame is higher, deformation caused by abnormal production is not likely to happen, the strength and supporting strength of the pins are higher, and deformation of the base island or the pins caused by multiple times of bonding can be avoided. After the chip is packaged into a single packaged product, the chip finished product is completely wrapped by the plastic package body without connecting ribs, so that the DFN or QFN lead frame has excellent sealing performance, and water vapor is extremely difficult to intrude into the plastic package body; and the phenomenon of abnormal glue overflow in the plastic packaging process is avoided.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a DFN or QFN lead frame and a manufacturing method thereof. Background technique [0002] DFN or QFN is a flat leadless chip packaging method. DFN (DualFlatNo-leadPackage) is a double-sided flat leadless package, and QFN (QuadFlatNo-leadPackage) is a quadrilateral flat leadless package. Both packages require Lead frame is used. In the prior art, the lead frame is stamped from copper sheet, including multiple lead frame units. The lead frame units are connected by connecting ribs to form an array, and then the chip is bonded on the lead frame. , Bond wires, then plastic seal, and finally cut and separate to obtain a single packaged product. The utilization rate of this kind of lead frame material is low, the strength of the pin is average, and it is easy to deform when the wire is bonded for many times, so it needs to be improved. Contents of the invention [0003] The ...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L21/48
CPCH01L21/4821H01L23/49541
Inventor 蔡择贤张怡程浪冯学贵卢茂聪
Owner GUANGDONG CHIPPACKING TECH
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