A method for setting the temperature curve of reflow oven for multi-variety and small batch

A temperature curve, small batch technology, applied in CAD circuit design, design optimization/simulation, computer-aided design, etc., to reduce costs, improve confidence, and low implementation costs

Active Publication Date: 2022-03-01
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the production mode of multiple varieties and small batches, it is generally not possible to set a separate reflow program and measure the temperature curve for each printed circuit board assembly

Method used

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  • A method for setting the temperature curve of reflow oven for multi-variety and small batch

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Embodiment Construction

[0019] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0020] A method for setting the temperature curve of a reflow oven for multi-variety and small batches, comprising the following steps:

[0021] Step 1: Analyze the influence of the characteristic factors of the printed board assembly on the reflow soldering temperature curve under a standard heating condition.

[0022] Step 2: According to the strength of the influencing factors, the types of printed board components are divided according to the actual application, and the preliminary classification is carried out. In the preliminary classification, printed board components are divided into several categories, and each category is subdivided into several subcategories;

[0023] Step 3: Set a corresponding reflow program for each category after division, and use the printed board components with corresponding characteristics to measu...

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Abstract

The invention discloses a method for setting the temperature curve of a reflow furnace for multi-variety and small batches, and belongs to the technical field of reflow soldering. The method includes the following steps: analyzing the influence of characteristic factors of printed board components on the reflow soldering temperature curve under a standard heating condition; dividing the types of printed board components according to the strength of the influencing factors in combination with practical applications, and conducting a preliminary Classification; set the corresponding reflow program for each class after division, and use the printed board components corresponding to the characteristics to measure the temperature curve and adjust the welding program, and finally obtain the temperature curve that meets the requirements of the process window, and solidify the soldering program; use The corresponding relationship between the adjusted temperature curve and the characteristics of the printed board is used for reflow soldering of the corresponding printed board. The invention is applicable to the welding mode of multi-variety and small-batch printed boards, and has high work efficiency and low implementation cost.

Description

technical field [0001] The invention relates to the technical field of reflow soldering, in particular to a method for setting the temperature curve of a reflow furnace for multi-variety and small batches. Background technique [0002] Reflow soldering is the use of hot air convection, infrared radiation, heat conduction, etc. to melt the solder paste pre-distributed on the pads of the printed circuit board, and form a mechanical and The process of electrical connection. For reflow soldering, the most important technical parameter is the reflow soldering temperature curve added to the printed circuit board assembly during soldering. This curve is a temperature curve that changes with time. Generally, the curve can be divided into preheating, heat preservation, There are four parts of reflow and cooling, and each part has a related process window. The reflow curve needs to meet the requirements of this process window to ensure the quality of welding. [0003] At present, co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/20H05K3/34G06F115/12G06F119/08
CPCG06F30/20H05K3/3494G06F2115/12G06F2119/08
Inventor 卢立东安华张莹贾红叶赵琳黎娜
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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