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T0263 double-row frame

A technology of arranging frames and frames, which is applied to electrical components, electrical solid devices, circuits, etc., can solve problems such as stacking instability, and achieve the effects of improving the utilization rate of raw materials, reducing unit prices, and improving production capacity.

Inactive Publication Date: 2020-11-10
NANTONG GAOXIN SCI & TECH DEVCO
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a T0263 double-row frame to solve the problem that only a single frame unit is connected to the sidebands on both sides of the lead frame proposed in the above-mentioned background technology and the lead frame is stacked together after the production is complete. unstable problem

Method used

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Embodiment Construction

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0015] see Figure 1-2 , the present invention provides a T0263 double-row frame, including a double-row frame main body 1, the double-row frame main body 1 is composed of two frame groups 2, and the two frame groups 2 are fixedly connected by several evenly distributed connectors 3, Both frame groups 2 are composed of several basic frame units 4 and side bands 5 , one side of the side band 5 is fixedly connected with several basic frame units 4 , and the adja...

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Abstract

The invention discloses a T0263 double-row frame, and the frame comprises a double-row frame body; the double-row frame body is composed of two frame sets, the two frame sets are fixedly connected through a plurality of evenly-distributed connecting pieces, and each frame set is composed of a plurality of basic frame units and side bands. According to the invention, two basic frame units which areoppositely arranged end to end are arranged in the longitudinal direction of each of the two frame sets in the frame, and the cooling fins of the basic frame unit on one side are connected with the cooling fins of the basic frame unit on the other side; the utilization rate of raw materials is increased by 50%, waste materials are reduced, and the unit price is reduced; due to the fact that the cooling fins of the two basic frame units are connected together, the cooling fins of the two basic frame units and the base island can be bent and formed at a time; under the same equipment configuration, the capacity is greatly improved, and through the positioning grooves, lamination of the lead frame in the later storage and packaging process is facilitated.

Description

technical field [0001] The invention relates to a lead frame, in particular to a T0263 double-row frame, which belongs to the technical field of semiconductor elements. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the external lead by means of a bonding material, forming an electrical circuit. It acts as a bridge connecting the external wire. Plastic-encapsulated lead frames are required in most semiconductor integrated blocks, which are important basic materials in the electronic information industry. [0003] In the existing lead frames, only a single frame unit is connected to the side bands on the upper and lower sides of most lead frames, and most of the space on the raw materials cannot be used, resulting in a large amount of waste in the production process. The output is low and the cost is high, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495
CPCH01L23/49541H01L23/49568
Inventor 张晓林张龙
Owner NANTONG GAOXIN SCI & TECH DEVCO